Abstract: A domain wall injector device uses electrical current passed across an interface between two magnetic regions whose magnetizations are aligned non-collinearly to create a domain wall or a series of domain walls in one of the magnetic regions. The method relies on a combination of innate fringing fields from the magnetic regions and the spin-transfer torque derived from the charge current. The device may be used to store data that are subsequently read out.

Abstract: A domain wall injector device uses electrical current passed across an interface between two magnetic regions whose magnetizations are aligned non-collinearly to create a domain wall or a series of domain walls in one of the magnetic regions. The method relies on a combination of innate fringing fields from the magnetic regions and the spin-transfer torque derived from the charge current. The device may be used to store data that are subsequently read out.

Abstract: Disclosed is a metal oxide semiconductor field effect transistor (MOSFET) having phase transition material incorporated into one or more components and an associated method. The MOSFET can comprise an asymmetric gate electrode having a phase transition material section (e.g., a chromium or titanium-doped vanadium dioxide (VO2) section) above the drain-side of the channel region. Additionally or alternatively, the MOSFET can comprise source and drain contact landing pads comprising different phase transition materials (e.g., un-doped VO2 and chromium or titanium-doped VO2, respectively). In any case, the phase transition material(s) are pre-selected so as to be insulative when the MOSFET is in the OFF state and the voltage difference between the drain region and the source region (VDS) is high in order to minimize leakage current and so as to be conductive when the MOSFET is in the ON state and VDS is high in order to maintain drive current.

Abstract: Disclosed is a metal oxide semiconductor field effect transistor (MOSFET) having phase transition material incorporated into one or more components and an associated method. The MOSFET can comprise an asymmetric gate electrode having a phase transition material section (e.g., a chromium or titanium-doped vanadium dioxide (VO2) section) above the drain-side of the channel region. Additionally or alternatively, the MOSFET can comprise source and drain contact landing pads comprising different phase transition materials (e.g., un-doped VO2 and chromium or titanium-doped VO2, respectively). In any case, the phase transition material(s) are pre-selected so as to be insulative when the MOSFET is in the OFF state and the voltage difference between the drain region and the source region (VDS) is high in order to minimize leakage current and so as to be conductive when the MOSFET is in the ON state and VDS is high in order to maintain drive current.

Abstract: A semiconductor device formed between a wordline and a bitline comprises a growth layer, an antiferromagnetic layer formed on the growth layer, a pinned layer formed on the antiferromagnetic layer, a tunnel barrier layer formed on the pinned layer, and a free layer formed on the tunnel barrier. The wordline and bitline are arranged substantially orthogonal to one another. The growth layer, in turn, comprises tantalum and has a thickness greater than about 75 Angstroms. Moreover, the pinned layer comprises one or more pinned ferromagnetic sublayers. The tunnel barrier comprises magnesium oxide. Finally, the free layer comprises two or more free ferromagnetic sublayers, each free ferromagnetic sublayer having a magnetic anisotropy axis that is oriented about 45 degrees from the wordline and bitline. The semiconductor device may comprise, for example, a magnetic tunnel junction for use in magnetoresistive random access memory (MRAM) circuitry.