Abstract: A conformal cooling assembly for multiple-die electronic assemblies, such as printed circuit boards, integrated circuits, etc., which addresses and solves a multitude of challenges and problems associated with using liquid-cooled cold plates and dielectric immersion cooling to manage the heat produced by a multiplicity of dies. The conformal cooling assembly comprises a conformal cooling module comprising inlet and outlet passageways and a plenum configured to permit a cooling fluid to pass therethrough, thereby facilitating direct fluid contact with heat-generating components affixed to the substrate of the electronic assembly. The conformal cooling assembly also includes a fastener for attaching the conformal cooling module to the substrate; and a fluid-barrier disposed between the substrate and the plenum. The fluid-barrier is adapted to minimize, inhibit or prevent the cooling fluid from penetrating and being absorbed by the substrate.

Abstract: A conformal cooling assembly for multiple-die electronic assemblies, such as printed circuit boards, integrated circuits, etc., which addresses and solves a multitude of challenges and problems associated with using liquid-cooled cold plates and dielectric immersion cooling to manage the heat produced by a multiplicity of dies. The conformal cooling assembly comprises a conformal cooling module comprising inlet and outlet passageways and a plenum configured to permit a cooling fluid to pass therethrough, thereby facilitating direct fluid contact with heat-generating components affixed to the substrate of the electronic assembly. The conformal cooling assembly also includes a fastener for attaching the conformal cooling module to the substrate; and a fluid-barrier disposed between the substrate and the plenum. The fluid-barrier is adapted to minimize, inhibit or prevent the cooling fluid from penetrating and being absorbed by the substrate.