Abstract: The invention provides for a turbine, which includes a duct that may provide an elongate circular internal passage that may have an open upstream end forming an intake and an open downstream end forming an exhaust. The turbine may further include a turbine rotor that may be rotatably mounted in and coaxially with the internal passage and may have at least one rotor blade extending helically along the internal passage so that airflow through the internal passage from the intake to the exhaust may impinge on the rotor blade and may drive the turbine rotor to turn. The duct may further provide at least one intermediate inlet disposed between the intake and the exhaust and part way along the rotor blade.

Abstract: A connector assembly that includes an electrical connector having a connector conductor, a connector housing, a PCB substrate bonded to a base, positioning pads extending away from the PCB substrate, and metallic bumps extending away from the PCB substrate. The connector housing has a housing conductor that is electrically connected to the connector conductor. The PCB substrate is brittle, and the housing conductor contacts an electrical signal path on the PCB substrate at an oblique angle. The positioning pads keep the mounting face of the connector housing away from the PCB substrate at a standoff distance. The metallic bumps are malleable and configured to provide an electrical connection between the PCB substrate and the mounting face of the connector housing.

Abstract: There is provided a flavored vaporizable formulation comprising (i) one or more solvents; (ii) a flavor; and (iii) one or more cyclodextrins; wherein the flavored vaporizable formulation contains water in an amount of from 0 to 10 wt. % based on the vaporizable formulation.

Abstract: Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method. It is emphasized that this Abstract is provided to comply with the rules requiring an abstract. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: The invention relates to a method and system for monitoring tray activity in which a tray sensing device detects the presence of a tray in a given location. The tray can be a conventional tray for supporting food articles or can be supported or integral with a food cart. Information from the tray sensing device can be forwarded to a central information system. The central information system can display the information or activate an alarm. The alarm can be an audio or visual alert. The alarm can be deactivated upon removal of the tray from the given location or upon dispatching of personnel to the given location.

Abstract: A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system.

Abstract: Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method. It is emphasized that this Abstract is provided to comply with the rules requiring an abstract. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.