Abstract: In one embodiment, there is a method that can include utilizing a ring oscillator module to determine a process corner of an integrated circuit as fabricated that includes the ring oscillator module. The impedance of an output driver of the integrated circuit can be altered based on the process corner of the integrated circuit as fabricated.

Abstract: In one embodiment, there is a method that can include utilizing a ring oscillator module to determine a process corner of an integrated circuit as fabricated that includes the ring oscillator module. The impedance of an output driver of the integrated circuit can be altered based on the process corner of the integrated circuit as fabricated.

Abstract: One embodiment in accordance with the invention is a method that can include utilizing a ring oscillator module to determine a process corner of an integrated circuit as fabricated that includes the ring oscillator module. The impedance of an output driver of the integrated circuit can be altered based on the process corner of the integrated circuit as fabricated.

Abstract: A signal line 12 has at a first location a first driver 14 to drive a first signal level on that signal line 12. A second driver 16 is provided at a second location, separated from the first location, and serves to drive the line signal to a different value from that driven by the first driver 14. Associated with each of these drivers 14, 16 are respective keeper circuits 18, 20, 22; 24, 26, 28 serving to maintain the signal value driven by the respective remote driver 16; 14. Thus, the first keeper 18, 20, 22 local to the first driver 14 serves to maintain the signal value driven by the second driver 16. The keepers 18, 20, 22; 24, 26, 28 are disabled by the control signal which enables their local driver 14; 16 and thus do not contend with the change being driven by their local driver 14, 16.

Abstract: One embodiment in accordance with the invention is a method that can include utilizing a ring oscillator module to determine a process corner of an integrated circuit as fabricated that includes the ring oscillator module. The impedance of an output driver of the integrated circuit can be altered based on the process corner of the integrated circuit as fabricated.

Abstract: A signal line 12 has at a first location a first driver 14 to drive a first signal level on that signal line 12. A second driver 16 is provided at a second location, separated from the first location, and serves to drive the line signal to a different value from that driven by the first driver 14. Associated with each of these drivers 14, 16 are respective keeper circuits 18, 20, 22; 24, 26, 28 serving to maintain the signal value driven by the respective remote driver 16; 14. Thus, the first keeper 18, 20, 22 local to the first driver 14 serves to maintain the signal value driven by the second driver 16. The keepers 18, 20, 22; 24, 26, 28 are disabled by the control signal which enables their local driver 14; 16 and thus do not contend with the change being driven by their local driver 14, 16.

Abstract: Multiple processors are mounted on a single die. The die is connected to a memory storing multiple operating systems or images of multiple operating systems. Each of the processors or a group of one or more of the processors is operable to execute a distinct one of the multiple operating systems. Therefore, resources for a single operating system may be dedicated to one processor or a group of processors. Consequently, a large number of processors mounted on a single die can operate efficiently.

Abstract: A power efficient flip-flop includes a power switch regulating power supplied to a high speed latch in the flip-flop. When the power switch is activated, causing the high speed latch to receive power, the high speed latch captures data received by the flip-flop. The captured data is propagated by the high speed latch to the output of the flip-flop. Simultaneously, the high speed latch transmits the data to a low leakage latch connected to the high speed latch. Then, power is removed from the high speed latch, and the data retained in the low leakage static latch is now released to the output of the flip-flop. The power efficient flip-flop minimizes leakage current generated by the high speed latch by removing a path to ground when power is not provided to the high speed latch. A decoupling device is connected to the power switch to substantially eliminate a coupling effect.