Abstract: Systems and methods for producing and delivering vapor are disclosed. A vaporizer tank containing a liquid may be heated such that liquid within the tank is heated and vapor generated. The flow of this vapor to a destination may then be regulated. Embodiments of the present invention may control the temperature of this liquid such that a saturated vapor condition is substantially maintained in the vaporizer tank. The vaporizer tank is coupled to a mass flow controller which regulates the delivery of the vapor to downstream components. By substantially maintaining the saturated vapor condition within the vaporizer tank the pressure of vapor at the mass flow controller can be substantially maintained and a stable and consistent flow rate of vapor achieved.

Abstract: Systems and methods for controlling the temperature of a wafer are disclosed. These systems and methods may employ a back side wafer pressure control system (BSWPC) that includes subsystems and a controller operable in tandem to control the temperature of wafers in one or more process chambers. The subsystems may include mechanical components for controlling a flow of gas to the backside of a wafer while the controller may be utilized to control these mechanical components in order to control wafer temperature in a process chamber. Furthermore, embodiments of these systems and methods may also use a chiller in combination with the controller to provide both coarse and fine temperature control.

Abstract: Systems and methods for producing and delivering vapor are disclosed. A vaporizer tank containing a liquid may be heated such that liquid within the tank is heated and vapor generated. The flow of this vapor to a destination may then be regulated. Embodiments of the present invention may control the temperature of this liquid such that a saturated vapor condition is substantially maintained in the vaporizer tank. The vaporizer tank is coupled to a mass flow controller which regulates the delivery of the vapor to downstream components. By substantially maintaining the saturated vapor condition within the vaporizer tank the pressure of vapor at the mass flow controller can be substantially maintained and a stable and consistent flow rate of vapor achieved.

Abstract: One embodiment of the present invention can comprise a primary flow measurement system, a secondary flow measurement system in fluid communication with the primary flow measurement system and a control coupled to the primary flow measurement system and the secondary flow measurement system. The controller can comprise a processor and a memory accessible by the processor. The processor can execute computer instructions stored on the memory to calculate a flow rate using the primary flow measurement system, in a first mode of operation, and calculate the flow rate using the secondary flow measurement system, in a second mode of operation. The computer instructions can be further executable to switch between the first mode of operation and the second mode of operation based on a predefined parameter.

Abstract: One embodiment of the present invention can comprise a primary flow measurement system, a secondary flow measurement system in fluid communication with the primary flow measurement system and a control coupled to the primary flow measurement system and the secondary flow measurement system. The controller can comprise a processor and a memory accessible by the processor. The processor can execute computer instructions stored on the memory to calculate a flow rate using the primary flow measurement system, in a first mode of operation, and calculate the flow rate using the secondary flow measurement system, in a second mode of operation. The computer instructions can be further executable to switch between the first mode of operation and the second mode of operation based on a predefined parameter.

Abstract: Systems and methods for flow verification and validation of mass flow controllers are disclosed. A mass flow controller may be commanded to a specified flow and flow measurement commenced. During an interval, gas is accumulated in a first volume and measurements taken within this volume. The various measurements taken during the interval may then be used to calculate the flow rate. The flow rate, in turn, may be used to determine the accuracy of the mass flow controller relative to a setpoint.

Abstract: Systems and methods for flow verification and validation of mass flow controllers are disclosed. A mass flow controller may be commanded to a specified flow and flow measurement commenced. Gas is accumulated in a first volume and while measurements are taken within this volume. Gas may then flow into a second volume while measurements are taken. The various measurements taken during the two intervals may then be used to calculate the flow rate. The flow rate, in turn, may be used to determine the accuracy of the mass flow controller relative to a setpoint. Additionally, these systems and methods may utilize only one volume to perform flow verification by flowing gas into this volume, taking measurements, and calculating the flow rate based only upon this set of measurements.

Abstract: A flow restrictor (30) for a mass flow metering device formed of a solid material and slots (32) originating from an outer surface towards inward.

Abstract: Systems and methods for correcting measurements of fluid flow using device- specific information to compensate for differences between individual devices of the same design. In one embodiment, a method comprises providing device-specific calibration data; sensing a fluid flow; computing a measured fluid flow based on the sensed fluid flow, and correcting the measured fluid flow based on the device-specific calibration data. More particularly, the fluid flow measurement is corrected using correction factors that compensate for the use of a gas that is different from the calibration gas (CF0 (1+aF+bF2+cF3)), for device variations in sensor sensitivity (1+??R), and for variations in the split flow of fluid through the flow meter (1???ADC(Sp/100)2). The sensor and split flow correction factors may be used independently of each other in some embodiments.