Patents by Inventor Su-Byeong Chae

Su-Byeong Chae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming copper film on Mo/SUS flexible substrate
    Patent number: 9281094
    Abstract: This invention relates to a method of forming a copper film on a Mo/SUS flexible substrate, which enables the copper film to be uniformly formed on the Mo/SUS flexible substrate in a short period of time by applying current and in which the copper film becomes thicker in proportion to an increase in a concentration of a copper precursor aqueous solution or in a current density.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: March 8, 2016
    Assignee: Korea University Research and Business Foundation
    Inventors: Chi-Woo Lee, Mi-Kyung Oh, Jeom-Sik Yang, Su-Byeong Chae, Sang-Min Lee
  • METHOD OF FORMING COPPER FILM ON MO/SUS FLEXIBLE SUBSTRATE
    Publication number: 20140295211
    Abstract: This invention relates to a method of forming a copper film on a Mo/SUS flexible substrate, which enables the copper film to be uniformly formed on the Mo/SUS flexible substrate in a short period of time by applying current and in which the copper film becomes thicker in proportion to an increase in a concentration of a copper precursor aqueous solution or in a current density.
    Type: Application
    Filed: November 26, 2013
    Publication date: October 2, 2014
    Applicant: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Chi-Woo Lee, Mi-Kyung Oh, Jeom-Sik Yang, Su-Byeong Chae, Sang-Min Lee