Patents by Inventor Su-Cheng LEE

Su-Cheng LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079267
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first diffusion barrier layer made of a dielectric material including a metal element, nitrogen, and oxygen and a first protection layer made of a dielectric material including silicon and oxygen and in direct contact with the top surface of the first diffusion barrier layer. The semiconductor device structure also includes a first thickening layer made of a dielectric material including the metal element and oxygen and in direct contact with the top surface of the first protection layer. A maximum metal content in the first thickening layer is greater than that in the first diffusion barrier layer. The semiconductor device structure further includes a conductive feature surrounded by and in direct contact with the first diffusion barrier layer, the first protection layer, and the first thickening layer.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Cheng SHIH, Tze-Liang LEE, Jen-Hung WANG, Yu-Kai LIN, Su-Jen SUNG
  • Patent number: 10987398
    Abstract: The present disclosure relates to a herbal compound extract to moderate diabetes with liver necrosis and fibrosis and applications thereof wherein a herbal compound consists of 10 to 20 units rhizome of Dendrobium nobile Lindl, 6 to 12 units fruiting body of Antrodia camphorata, 12 to 20 units root of Panax ginseng C. A. Mey, 10 to 30 units root of Rehmannia glutinosa Libosch, 15 to 30 units rhizome of Salvia miltiorrhiza Bge., 6 to 12 units all of Pheretima asperfillm (E. Perrier), 10 to 30 units root of Pueraria mirifica, 8 to 15 units fruit of Schisandra chinensis (Turcz.) Baill and 6 to 8 units rhizome of Glycyrrhiza uralensis Fisch and the herbal compound extract is able to moderate symptoms comprising hyperglycemia, hyperlipidemia, abnormal liver function about liver necrosis and fibrosis due to the diabetes.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: April 27, 2021
    Assignee: OMICS LIFESCIENCE CO., LTD
    Inventors: Tzu-Chih Hsiao, Su-Cheng Lee, Chia-Fu Hsiao, Yen-Yu Hsiao
  • Publication number: 20190351001
    Abstract: The present disclosure relates to a herbal compound extract to moderate diabetes with liver necrosis and fibrosis and applications thereof wherein a herbal compound consists of 10 to 20 units rhizome of Dendrobium nobile Lindl, 6 to 12 units fruiting body of Antrodia camphorata, 12 to 20 units root of Panax ginseng C. A. Mey, 10 to 30 units root of Rehmannia glutinosa Libosch, 15 to 30 units rhizome of Salvia miltiorrhiza Bge., 6 to 12 units all of Pheretima asperfillm (E. Perrier), 10 to 30 units root of Pueraria mirifica, 8 to 15 units fruit of Schisandra chinensis (Turcz.) Baill and 6 to 8 units rhizome of Glycyrrhiza uralensis Fisch and the herbal compound extract is able to moderate symptoms comprising hyperglycemia, hyperlipidemia, abnormal liver function about liver necrosis and fibrosis due to the diabetes.
    Type: Application
    Filed: May 21, 2018
    Publication date: November 21, 2019
    Inventors: Tzu-Chih HSIAO, Su-Cheng LEE, Chia-Fu HSIAO, Yen-Yu HSIAO