Abstract: An exemplary street lamp includes a solid-state light source and a light guiding plate. The light source is used to emit light to illuminate a portion of the traffic lane. The illuminated portion includes a first section and a second section at opposite sides of the projection of the light source on the traffic lane. The solid-state light source defines a central axis perpendicular to a lengthwise direction of the traffic lane. The plate includes a light incident surface and a light output surface at opposite sides thereof. The plate is used to deviate the light from the light source. In this manner, a maximum light intensity in the first section is less than or equal to 60 percent of a maximum light intensity in the second section.

Abstract: An LED lamp for lighting purpose includes a lamp base, a heat sink, a plurality of LED modules and a blower. The lamp base encloses an inner space and defines a plurality of vents therein. The vents communicate the inner space with a surrounding atmosphere. The heat sink comprises a cylinder at a center thereof. The cylinder has a through hole therein, which communicates with the inner space and vents of the lamp base and cooperates therewith to form an air passage. The LED modules are attached to a periphery of the heat sink. The blower generates an airflow circulating through the air passage to thereby dissipate heat generated by the LED modules.

Abstract: An LED lamp for lighting purpose includes a lamp base, a heat sink, a plurality of LED modules and a blower. The lamp base encloses an inner space and defines a plurality of vents therein. The vents communicate the inner space with a surrounding atmosphere. The heat sink comprises a cylinder at a centre thereof. The cylinder has a through hole therein, which communicates with the inner space and vents of the lamp base and cooperates therewith to form an air passage. The LED modules are attached to a periphery of the heat sink. The blower generates an airflow circulating through the air passage to thereby dissipate heat generated by the LED modules.

Abstract: A method of dissipating heat, packaging and shaping for light emitting diodes enhances the heat dissipation performance of light emitting diodes, and its structure includes a substrate and a light emitting diode chip. An antioxidation is performed at a high temperature at a predetermined position for installing a chip on the surface of the substrate; a layer of intermetallic layer is coated; a solder material is placed on the intermetallic layer and at the predetermined position of the chip; an intermetallic layer is also coated onto the adhering surface of the chip; the adhering surface of the chip is coupled with the solder material; meanwhile the intermetallic layer and the solder material are heated by furnace to form a stable metal alloy structure, so that the chip can be fixed onto the substrate; and finally the light emitting diode structure is completed by a wirebond process.