Patents by Inventor Su-Dong Shin

Su-Dong Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8361370
    Abstract: A horizontal injection mold system includes a horizontal injection mold which is opened or closed in a direction perpendicular to a direction of gravity; and an insert member feeder which feeds an insert member into the horizontal injection mold, such that a resin coupling surface of the insert member faces a gate disposed in the horizontal injection mold.
    Type: Grant
    Filed: July 15, 2010
    Date of Patent: January 29, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventors: Su-Dong Shin, Myoung-Jin Kim, Jeong-Hun Heo
  • Publication number: 20110147987
    Abstract: A horizontal injection mold system includes a horizontal injection mold which is opened or closed in a direction perpendicular to a direction of gravity; and an insert member feeder which feeds an insert member into the horizontal injection mold, such that a resin coupling surface of the insert member faces a gate disposed in the horizontal injection mold.
    Type: Application
    Filed: July 15, 2010
    Publication date: June 23, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Su-Dong SHIN, Myoung-Jin KIM, Jeong-Hun HEO
  • Patent number: 7867430
    Abstract: Provided is an injection mold which can reduce the amount of resin that is separated from injection-molded parts and then thrown away. The injection mold includes for an embodiment an extension cylinder coupled to an upper clamp plate and having a nozzle at an end thereof; a nozzle positioner disposed under the nozzle, the nozzle positioner having a nozzle insertion groove adapted to receive the nozzle; a gate-lock-pin holder disposed under the extension cylinder and the nozzle positioner, comprising a gate lock pin which has a first end coupled to a gate molded part and a second end coupled to the gate-lock-pin holder, and adapted to separate the gate molded part from an injection-molded part; a gate stripper plate disposed under the gate-lock-pin holder and adapted to separate the gate molded part from the nozzle; and a cavity plate and a core plate disposed under the gate stripper plate and having a cavity which is shaped like the injection-molded part.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: January 11, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Su-Dong Shin, Myoung-Jin Kim, Jeong-Hun Heo
  • Publication number: 20100295216
    Abstract: Provided is an injection mold which can reduce the amount of resin that is separated from injection-molded parts and then thrown away. The injection mold includes for an embodiment an extension cylinder coupled to an upper clamp plate and having a nozzle at an end thereof; a nozzle positioner disposed under the nozzle, the nozzle positioner having a nozzle insertion groove adapted to receive the nozzle; a gate-lock-pin holder disposed under the extension cylinder and the nozzle positioner, comprising a gate lock pin which has a first end coupled to a gate molded part and a second end coupled to the gate-lock-pin holder, and adapted to separate the gate molded part from an injection-molded part; a gate stripper plate disposed under the gate-lock-pin holder and adapted to separate the gate molded part from the nozzle; and a cavity plate and a core plate disposed under the gate stripper plate and having a cavity which is shaped like the injection-molded part.
    Type: Application
    Filed: December 8, 2009
    Publication date: November 25, 2010
    Inventors: Su-Dong Shin, Myoung-Jin Kim, Jeong-Hun Heo