Abstract: The present invention provides a wire bonding apparatus for performing a wire bonding operation on a workpiece having a planar upper surface. The wire bonding apparatus includes a capillary for performing wire bonding and a drive unit for positioning the capillary. The wire bonding apparatus also includes a controller that controls the drive unit and the capillary. This controller generates an equation that defines the plane of the workpiece. Further, the controller determines the difference in height between the home position of the capillary and a selected bonding position on the workpiece based on the equation of the plane. The controller also determines a speed profile for moving the wire bonding apparatus toward the selected bonding position. This speed profile divides the difference in height into first and second sections. Preferably, the second section associated with each bonding position has the same heights.