Abstract: A light emitting diode (LED) device includes a transparent substrate, a first reflection layer, a LED chip, a positive electrode, a negative electrode and a wavelength-converting layer. The LED chip is disposed on a surface of the transparent substrate, and the first reflection layer is disposed between the LED chip and the transparent substrate. The positive electrode and the negative electrode are disposed on an end portion of the transparent substrate and are electrically connected with the LED chip. The wavelength-converting layer covers the first reflection layer and the LED chip.

Abstract: A light-emitting device package is disclosed. The light-emitting device package includes a metal substrate. An insulating layer is on the metal substrate, wherein the insulating layer has at least one opening to expose the metal substrate. At least one light-emitting device is disposed in the at least one opening of the insulating layer. A sidewall of the at least one opening of the insulating layer is covered by an optical spacer. The disclosure also provides a method for manufacturing the light-emitting device package.

Abstract: A comprehensive light-emitting diode device including a translucent substrate, a light-emitting diode chip, a reflective layer, a first wavelength conversion layer, and a second wavelength conversion layer. The translucent substrate includes a first surface and a second surface opposite to the first surface. The light-emitting diode chip is disposed on the first surface. The reflective layer is disposed on the first surface. The light-emitting diode chip is surrounded by the reflective layer. The first wavelength conversion layer is disposed on the first surface. The light-emitting diode chip and the reflective layer are covered by the first wavelength conversion layer.

Abstract: A comprehensive light-emitting diode device including a translucent substrate, a light-emitting diode chip, a reflective layer, a first wavelength conversion layer, and a second wavelength conversion layer. The translucent substrate includes a first surface and a second surface opposite to the first surface. The light-emitting diode chip is disposed on the first surface. The reflective layer is disposed on the first surface. The light-emitting diode chip is surrounded by the reflective layer. The first wavelength conversion layer is disposed on the first surface. The light-emitting diode chip and the reflective layer are covered by the first wavelength conversion layer.

Abstract: A light emitting diode (LED) device includes a transparent substrate, a first reflection layer, a LED chip, a positive electrode, a negative electrode and a wavelength-converting layer. The LED chip is disposed on a surface of the transparent substrate, and the first reflection layer is disposed between the LED chip and the transparent substrate. The positive electrode and the negative electrode are disposed on an end portion of the transparent substrate and are electrically connected with the LED chip. The wavelength-converting layer covers the first reflection layer and the LED chip.

Abstract: A light-emitting device package is disclosed. The light-emitting device package includes a metal substrate. An insulating layer is on the metal substrate, wherein the insulating layer has at least one opening to expose the metal substrate. At least one light-emitting device is disposed in the at least one opening of the insulating layer. A sidewall of the at least one opening of the insulating layer is covered by an optical spacer. The disclosure also provides a method for manufacturing the light-emitting device package.

Abstract: A light emitting diode display panel includes a substrate and a plurality of pixels. The substrate includes a plurality of transverse signal lines and a plurality of longitudinal signal lines crossing each other. The pixels are mounted on the substrate in a matrix form. Each pixel includes a plurality of LEDs. The LEDs are electrically connected to one of the transverse signal lines and one of the longitudinal signal lines.

Abstract: A light-emitting diode structure is provided. The light-emitting diode structure comprises a substrate, a light-emitting diode device, a ring-shaped dam and an optical lens. The substrate has an upper surface. The light-emitting diode device is disposed on the upper surface of the substrate for emitting a first light having a first wavelength. The ring-shaped dam is disposed on the upper surface of the substrate, and surrounds the light-emitting diode device. The optical lens is disposed on the substrate, and encapsulates the ring-shaped dam and the light-emitting diode device. The optical lens and the ring-shaped dam and the light-emitting diode device form a cavity.

Abstract: An LED headlight cooling system includes a vehicle air conditioner, a thermal conducting device and an LED headlight. The vehicle air conditioner has a cooling device. The thermal conducting device is thermally connected to the cooling device of the vehicle air conditioner. The LED headlight is thermally connected to the thermal conducting device.

Abstract: An LED headlight cooling system includes a vehicle air conditioner, a thermal conducting device and an LED headlight. The vehicle air conditioner has a cooling device. The thermal conducting device is thermally connected to the cooling device of the vehicle air conditioner. The LED headlight is thermally connected to the thermal conducting device.

Abstract: A white-light LED device is disclosed. The white-light LED device includes a base, at least one purple light source and at least one yellow light source. The purple light source and the yellow light source are disposed on the base, and they are adjacent to each other such that the illuminations are mixed to produce white light. An illumination method is also disclosed. The illumination method includes the following steps: At least one purple light source and at least one yellow light source are disposed on a base. The illuminations of the yellow light source and the purple light source are mixed to produce white light.

Abstract: A semiconductor die includes a semiconductor substrate, electrodes provided on the semiconductor substrate, an isolating layer provided on the electrodes, an upper protective layer provided on the electrodes and the isolating layer, pads provided on the upper protective layer and connectors inserted through the upper protective layer and used to connect the electrodes to the pads. The area of the pads is larger than that of the electrodes.