Patents by Inventor Su-Hua Tung

Su-Hua Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding method of package components and bonding apparatus
    Patent number: 11955378
    Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang
  • Writing implement
    Patent number: D453792
    Type: Grant
    Filed: July 5, 2001
    Date of Patent: February 19, 2002
    Inventor: Su-Hua Tung