Abstract: There is provided a multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and an internal electrode formed in the ceramic body, wherein on a cross-section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode satisfies 0.1 ?m?Te?1.0 ?m, and when the internal electrode is divided into three regions including a central region and both edge regions in a width direction of the ceramic body and a ratio of an actual total length of the internal electrode corresponding to the sum of lengths of electrode portions to an ideal total length of the internal electrode is defined as connectivity S of the internal electrode, connectivity of the internal electrode in the edge regions satisfies 75%?S?98%, and a ratio of connectivity of the internal electrode in the edge regions to connectivity of the internal electrode in the central region is 0.9 to 0.98.

Abstract: There is provided a multilayer ceramic electronic component including, a ceramic body including dielectric layers, internal electrodes disposed in the ceramic body to face each other with the dielectric layers interposed therebetween, and having an average thickness of 1.0 ?m or less, and external electrodes formed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein at least one of the internal electrodes is formed of only a conductive metal.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a recess portion formed in a length direction of at least one main surface thereof so as to be inwardly concave and satisfying T (thickness)/W (width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to the at least one main surface, wherein when the ceramic body is divided into an upper region At, corresponding to 70% to 90% of an overall thickness of the ceramic body, and a lower region Ab, corresponding to 10% to 30% of the overall thickness of the ceramic body, a ratio of an average particle size of Ab materials to an average particle size of At materials is less than 0.5.

Abstract: The present invention relates to a multilayer electronic component having a structure in which a dielectric layer and an internal electrode layer are alternately laminated, which includes the dielectric layer and the internal electrode layer including metal powder and an inhibitor, wherein the inhibitor includes 0.5 to 20 mol % of a Ca component based on 100 mol % of a barium titanate (BT) base material, and a method for manufacturing the same. According to the present invention, it is possible to provide a multilayer electronic component that can implement excellent electrical characteristics and electrode connectivity by adding a Ca component to an internal electrode layer as a sub-component of the inhibitor to minimize the occurrence of oxygen vacancies on the interface formed when the inhibitor component included in the internal electrode layer moves to the dielectric layer.

Abstract: A conductive metal paste composition including conductive metal particles including first metal particles having a particle size of less than 100 nm, and second metal particle of particle size greater than 100 nm, and a surface coated with a capping material; a binder; and a solvent, a method of manufacturing the same, and an electrode and a conductive circuit of an electronic device using the same. The paste composition containing two or more kinds of conductive metal particles with different particle sizes can secure high conductivity compared to a conventional metal pastes during low temperature or short-time medium and high temperature sintering.

Abstract: The present invention provides a method of forming a conductive electrode structure including: applying a conductive paste on a substrate; forming a conductive pattern having an outwardly convex shape by heat-treating the conductive paste; and forming a solder layer to conformally cover the conductive pattern.

Abstract: Provided are a circuit board and an apparatus for processing a defect in a circuit board. The circuit board includes at least one non-defective cell including a non-defective circuit pattern, at least one defective cell including a defective circuit pattern, and a short line printed on the circuit pattern of the at least one defective cell.

Abstract: An inkjet printer includes: a cartridge body provided with an ink chamber; a head unit coupled to a bottom surface of the cartridge body and provided with nozzles for jetting ink; and an energy irradiation unit coupled to the cartridge body so as to irradiate energy onto the ink jetted from the nozzles of the head unit.

Abstract: Disclosed are methods of forming a printed circuit pattern and forming a guide, and a guide-forming ink. The method of forming a printed circuit pattern in accordance with the present invention includes forming a guide by using guide-forming ink having a slip property, curing the formed guide by in-situ UV, and forming a printed circuit pattern on the inside of the cured guide by using metal ink.