Abstract: An aerosol generating device includes a first vaporizer configured to generate a first aerosol by heating a first liquid composition, a second vaporizer configured to generate a second aerosol by heating a second liquid composition, and a controller controlling power supplied to the first vaporizer and the second vaporizer, based on a first mode, in which a smokeless aerosol is generated, and a second mode, in which a transport amount of nicotine included in the second liquid composition is adjusted.

Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, it is possible to produce an organic electroluminescent device having improved driving voltage, power efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.

Abstract: A transportation head for a microchip transfer device capable of minimizing mechanical and chemical damage to a microchip, a microchip transfer device having same, and a transfer method thereby, and the transportation head includes a head body having a pickup area and a dummy area; a first protruding pin disposed in the pickup area of the head body; and a liquid droplet attached to the first protruding pin.

Abstract: An electronic vaporizer for generating an aerosol includes a housing to be installed to an electronic device by being coupled to the electronic device through a connecting interface of the electronic device, and including: a connecting interface that receives power from a battery included in the electronic device when coupled to the connecting interface of the electronic device, a liquid storage for storing a liquid aerosol generating material and supplying the liquid aerosol generating material to a wick when the housing is disposed in a predetermined posture, an atomizer that includes a wick and a heater for generating an aerosol by heating the liquid aerosol generating material supplied to the wick, and a control circuit that controls heating of the heater for generating the aerosol, based on the power supplied from the battery.

Abstract: An integrated circuit device includes a substrate having source and drain recesses therein that are lined with respective silicon-germanium liners and filled with doped semiconductor source and drain regions. A stacked plurality of semiconductor channel layers are provided, which are separated vertically from each other within the substrate by corresponding buried insulated gate electrode regions that extend laterally between the silicon-germanium liners. An insulated gate electrode is provided on an uppermost one of the plurality of semiconductor channel layers. The silicon-germanium liners may be doped with carbon.

Abstract: Disclosed is a method for producing a zinc-aluminum-based alloy-coated steel sheet with superior workability and corrosion resistance by coating a base zinc-aluminum-based alloy-coated steel sheet in a coating bath comprising 35 to 55% by weight of zinc, 0.5 to 3% by weight of silicon, 0.005 to 1.0% by weight of chromium, 0.01 to 3.0% by weight of magnesium, 0.001 to 0.1% by weight of titanium, and the balance of aluminum and inevitable impurities.

Abstract: Disclosed is a method for producing a zinc-aluminum-based alloy-coated steel sheet with superior workability and corrosion resistance by coating a base zinc-aluminum-based alloy-coated steel sheet in a coating bath comprising 35 to 55% by weight of zinc, 0.5 to 3% by weight of silicon, 0.005 to 1.0% by weight of chromium, 0.01 to 3.0% by weight of magnesium, 0.001 to 0.1% by weight of titanium, and the balance of aluminum and inevitable impurities. With the method, it is possible to produce a zinc-aluminum-based alloy-coated steel sheet which exhibits superior workability through control of an intermetallic compound layer (Zn—Al—Si—Cr) and formation of AlCr2 due to Cr component present in the coating layer, reduces detachment of the coating layer and cracks of coating occurring during molding, exhibits superior corrosion resistance even after processing and has considerably superior corrosion resistance due to Mg2Si alloy phase and inhibition of oxide film formation.