Abstract: Proposed is a method for estimating the mass of microplastics by using fluorescent staining. The method may include staining microplastic samples by using a Nile red solution, and capturing a fluorescent image of each of the stained microplastic samples after classifying the stained microplastic samples by mass. The method may also include analyzing the captured fluorescent image to quantify a fluorescence intensity thereof to build a database (DB) about a correlation between mass and fluorescence intensity of microplastics. The method may further include estimating a mass value of an unknown microplastic sample by comparing a fluorescence intensity of a fluorescent image of the unknown microplastic sample obtained by performing the staining and capturing of the unknown microplastic sample with data stored in the database.

Abstract: A semiconductor package and or method of fabricating the semiconductor package may be provided. The semiconductor package may include a first die, at least one second die electrically connected to the first die, and a plurality of first connectors disposed on the interconnection structure layer. The semiconductor package may include a package substrate electrically connected to the plurality of first connectors. The package substrate may have a cavity and the at least one second die is at least partially disposed in the cavity. The interconnection structure layer may include signal paths electrically connected to the first die and to the at least one second die. The at least one second die may be positioned to minimize a length of the signal paths.