Patents by Inventor Su-Hyun Cha

Su-Hyun Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8323037
    Abstract: Example embodiments relate to semiconductor modules and semiconductor devices including the same. The semiconductor module may include a board, a plurality of semiconductor chips, a plurality of first taps, and a plurality of second taps. The board may include a chip region, a first tap region, and a second tap region. The first tap region of the board may have a first width that extends in a thickness direction of the board. The second tap region may have a second width that is less than the first width. The second tap region may be disposed under the first tap region. The semiconductor chips may be mounted in the chip region of the board. The first taps may be disposed in the first tap region, and the second taps may be disposed in the second tap region. The first and second taps may be configured to transmit/receive an electric signal to/from the plurality of semiconductor chips.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: December 4, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Su-Hyun Cha, Junghoon Kim, Seongchan Han
  • Publication number: 20120058650
    Abstract: Example embodiments relate to semiconductor modules and semiconductor devices including the same. The semiconductor module may include a board, a plurality of semiconductor chips, a plurality of first taps, and a plurality of second taps. The board may include a chip region, a first tap region, and a second tap region. The first tap region of the board may have a first width that extends in a thickness direction of the board. The second tap region may have a second width that is less than the first width. The second tap region may be disposed under the first tap region. The semiconductor chips may be mounted in the chip region of the board. The first taps may be disposed in the first tap region, and the second taps may be disposed in the second tap region. The first and second taps may be configured to transmit/receive an electric signal to/from the plurality of semiconductor chips.
    Type: Application
    Filed: August 3, 2011
    Publication date: March 8, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Su-Hyun Cha, Junghoon Kim, Seongchan Han