Patents by Inventor Su-il CHO

Su-il CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thickness prediction network learning method, semiconductor device manufacturing method, and semiconductor material deposition equipment
    Patent number: 11494642
    Abstract: A thickness prediction network learning method includes measuring spectrums of optical characteristics of a plurality of semiconductor structures each including a substrate and first and second semiconductor material layers alternately stacked thereon to generate sets of spectrum measurement data, measuring thicknesses of the first and second semiconductor material layers to generate sets of thickness data, training a simulation network using the sets of spectrum measurement data and the sets of thickness data, generating sets of spectrum simulation data of spectrums of the optical characteristics of a plurality of virtual semiconductor structures based on thicknesses of first and second virtual semiconductor material layers using the simulation network, each of the first and second virtual semiconductor layers including the same material as the first and second semiconductor material layers, respectively; and training a thickness prediction network by using the sets of spectrum measurement data and the sets
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: November 8, 2022
    Assignees: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and Technology
    Inventors: Su-il Cho, Sung-yoon Ryu, Yu-sin Yang, Chi-hoon Lee, Hyun-su Kwak, Jung-won Kim
  • THICKNESS PREDICTION NETWORK LEARNING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR MATERIAL DEPOSITION EQUIPMENT
    Publication number: 20200193290
    Abstract: A thickness prediction network learning method includes measuring spectrums of optical characteristics of a plurality of semiconductor structures each including a substrate and first and second semiconductor material layers alternately stacked thereon to generate sets of spectrum measurement data, measuring thicknesses of the first and second semiconductor material layers to generate sets of thickness data, training a simulation network using the sets of spectrum measurement data and the sets of thickness data, generating sets of spectrum simulation data of spectrums of the optical characteristics of a plurality of virtual semiconductor structures based on thicknesses of first and second virtual semiconductor material layers using the simulation network, each of the first and second virtual semiconductor layers including the same material as the first and second semiconductor material layers, respectively; and training a thickness prediction network by using the sets of spectrum measurement data and the sets
    Type: Application
    Filed: November 8, 2019
    Publication date: June 18, 2020
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Su-il CHO, Sung-yoon RYU, Yu-sin YANG, Chi-hoon LEE, Hyun-su KWAK, Jung-won KIM