Patents by Inventor SUJEONG HWANG

SUJEONG HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9932412
    Abstract: A bispecific antigen binding protein complex comprising a first polypeptide comprising a first antigen binding site at an N terminus; a second polypeptide comprising a second antigen binding site at an N terminus; and a linker connecting the first polypeptide and the second polypeptide; wherein the linker comprises a tag at one terminus thereof, and wherein the tag is connected to a C-terminus of the first polypeptide or to an N-terminus of the second polypeptide, and comprises a cleavable amino acid sequence; as well as related compositions and methods.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: April 3, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-kyung Kim, JungWook Lee, SuJeong Hwang, Jaeil Lee
  • Publication number: 20140127210
    Abstract: A bispecific antigen binding protein complex comprising a first polypeptide comprising a first antigen binding site at an N terminus; a second polypeptide comprising a second antigen binding site at an N terminus; and a linker connecting the first polypeptide and the second polypeptide; wherein the linker comprises a tag at one terminus thereof, and wherein the tag is connected to a C-terminus of the first polypeptide or to an N-terminus of the second polypeptide, and comprises a cleavable amino acid sequence; as well as related compositions and methods.
    Type: Application
    Filed: October 31, 2013
    Publication date: May 8, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: MIN-KYUNG KIM, JUNGWOOK LEE, SUJEONG HWANG, JAEIL LEE