Patents by Inventor Su Jeong Jeon

Su Jeong Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same
    Patent number: 9034750
    Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: May 19, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kwang-Seong Choi, Ho-eun Bae, Hyun-cheol Bae, Yong Sung Eom, Su Jeong Jeon
  • METHOD OF FABRICATING A SOLDER-ON-PAD STRUCTURE AND FLIP-CHIP BONDING METHOD USING THE SAME
    Publication number: 20140117070
    Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
    Type: Application
    Filed: March 18, 2013
    Publication date: May 1, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kwang-Seong Choi, Ho-eun Bae, Hyun-cheol Bae, Yong Sung EOM, Su Jeong Jeon