Patents by Inventor Su Kyoung Cha
Su Kyoung Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11742144Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer including a grain and first and second internal electrodes stacked in a third direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in a third direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a first direction; and first and second external electrodes disposed on the fifth surface and the sixth surface of the ceramic body, respectively, and a ratio, G/I, of a particle size, G, of a grain of the dielectric layer to a thickness, I, of each of the first and second internal electrodes is 0.3 or more and 0.5 or less.Type: GrantFiled: April 30, 2020Date of Patent: August 29, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Je Jung Kim, Su Kyoung Cha, Ji Won Lee, Seung Ryeol Lee
-
Patent number: 11393631Abstract: An electronic component includes a capacitor body having first to sixth surfaces, the capacitor body including a plurality of dielectric layers stacked in a first direction connecting the fifth and sixth surfaces and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; first and second external electrodes disposed on the first surface of the capacitor body, to be spaced apart from each other in a second direction connecting the third and fourth surfaces; and first and second metal frames connected to the first and second external electrodes, respectively. The first internal electrode includes a first lead portion exposed through the first surface of the capacitor body and connected to the first external electrode. The second internal electrode includes a second lead portion exposed through the first surface of the capacitor body and connected to the second external electrode.Type: GrantFiled: April 20, 2020Date of Patent: July 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Je Jung Kim, Su Kyoung Cha, Ji Won Lee, Seung Ryeol Lee
-
Patent number: 11302483Abstract: An electronic component includes a capacitor body having first to sixth surfaces, and including a plurality of dielectric layers and first and second internal electrodes; first and second external electrodes disposed on both ends of the capacitor body in a second direction in which the third and fourth surfaces oppose each other, respectively; a third external electrode disposed on the first surface of the capacitor body; and first to third metal frames connected to the first to third external electrodes, respectively, both ends of the first internal electrode are exposed through the third and fourth surfaces of the capacitor body, respectively, and the second internal electrode includes a lead portion exposed through the first surface of the capacitor body and connected to the third external electrode.Type: GrantFiled: April 21, 2020Date of Patent: April 12, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Je Jung Kim, Su Kyoung Cha, Ji Won Lee, Seung Ryeol Lee
-
Patent number: 11049661Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, and including first to sixth surfaces, a first external electrode including a first electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a first conductive resin layer, and a second external electrode including a second electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a second conductive resin layer. R1 and R2 satisfy R1>R2, in which R1 is defined as a surface roughness of each of the first, second, fifth, and sixth surfaces in contact with the first and second electrode layers, and R2 is defined as a surface roughness of each of the first, second, fifth, and sixth surfaces in contact with the first and second conductive resin layers.Type: GrantFiled: March 9, 2020Date of Patent: June 29, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Je Jung Kim, Seung Ryeol Lee, Su Kyoung Cha
-
Publication number: 20210183572Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer including a grain and first and second internal electrodes stacked in a third direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in a third direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a first direction; and first and second external electrodes disposed on the fifth surface and the sixth surface of the ceramic body, respectively, and a ratio, G/I, of a particle size, G, of a grain of the dielectric layer to a thickness, I, of each of the first and second internal electrodes is 0.3 or more and 0.5 or less.Type: ApplicationFiled: April 30, 2020Publication date: June 17, 2021Inventors: Je Jung KIM, Su Kyoung CHA, Ji Won LEE, Seung Ryeol LEE
-
Publication number: 20210183579Abstract: An electronic component includes a capacitor body having first to sixth surfaces, the capacitor body including a plurality of dielectric layers stacked in a first direction connecting the fifth and sixth surfaces and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; first and second external electrodes disposed on the first surface of the capacitor body, to be spaced apart from each other in a second direction connecting the third and fourth surfaces; and first and second metal frames connected to the first and second external electrodes, respectively. The first internal electrode includes a first lead portion exposed through the first surface of the capacitor body and connected to the first external electrode. The second internal electrode includes a second lead portion exposed through the first surface of the capacitor body and connected to the second external electrode.Type: ApplicationFiled: April 20, 2020Publication date: June 17, 2021Inventors: Je Jung KIM, Su Kyoung CHA, Ji Won LEE, Seung Ryeol LEE
-
Publication number: 20210183580Abstract: An electronic component includes a capacitor body having first to sixth surfaces, and including a plurality of dielectric layers and first and second internal electrodes; first and second external electrodes disposed on both ends of the capacitor body in a second direction in which the third and fourth surfaces oppose each other, respectively; a third external electrode disposed on the first surface of the capacitor body; and first to third metal frames connected to the first to third external electrodes, respectively, both ends of the first internal electrode are exposed through the third and fourth surfaces of the capacitor body, respectively, and the second internal electrode includes a lead portion exposed through the first surface of the capacitor body and connected to the third external electrode.Type: ApplicationFiled: April 21, 2020Publication date: June 17, 2021Inventors: Je Jung KIM, Su Kyoung CHA, Ji Won LEE, Seung Ryeol LEE
-
Publication number: 20210082623Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, and including first to sixth surfaces, a first external electrode including a first electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a first conductive resin layer, and a second external electrode including a second electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a second conductive resin layer. R1 and R2 satisfy R1>R2, in which R1 is defined as a surface roughness of each of the first, second, fifth, and sixth surfaces in contact with the first and second electrode layers, and R2 is defined as a surface roughness of each of the first, second, fifth, and sixth surfaces in contact with the first and second conductive resin layers.Type: ApplicationFiled: March 9, 2020Publication date: March 18, 2021Inventors: Je Jung Kim, Seung Ryeol Lee, Su Kyoung Cha