Patents by Inventor Su Liang Chan

Su Liang Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical information processing circuit assembly
    Patent number: 7324715
    Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: January 29, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Tecktiong Tan, Binghua Pan, Jeffrey H. Burns, Arun K. Chaudhuri, John R. Troxell, Su Liang Chan
  • Optical information processing circuit assembly
    Publication number: 20040114851
    Abstract: An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.
    Type: Application
    Filed: December 12, 2002
    Publication date: June 17, 2004
    Inventors: Tecktiong Tan, Binghua Pan, Jeffrey H. Burns, Arun K. Chaudhuri, John R. Troxell, Su Liang Chan