Abstract: A semiconductor process for preventing the layer on a wafer edge from peeling is provided. First, a dielectric layer is formed on the front side of a substrate. Then, a photoresist layer is formed to cover the front side and part of the backside of the substrate. Thereafter, an edge rinsing process is carried out only on the backside of the substrate to remove the photoresist layer on the back of the substrate while retaining the photoresist layer on the wafer edge area.

Abstract: A method for preventing reworked photoresist from collapsing is described. After stripping undesired photoresist off a wafer and before re-performing a lithography process thereon, the wafer is placed in a chemical vapor deposition chamber filled with N2O gas for a predetermined time to form a nitrogen-rich native oxide layer on the surface of the wafer. Afterwards, reworked photoresist is formed on the nitrogen-rich native oxide layer. The nitrogen-rich native oxide layer restores the moisture and the reflectivity of the surface of the wafer to a predetermined range before performing the photoresist reworking process. Hence, the invention prevents the reworked photoresist from collapsing and improves the fabrication yield.

Abstract: A scrubbing assembly for a wafer-cleaning device is provided. The wafer-cleaning device is provided with a base. The scrubbing assembly comprises a scrubber, a cup and an oscillator. The scrubber is disposed on the base in a manner such that it can move between a first position and a second position. The scrubber scrubs a wafer when it locates in the first position. The cup, for receiving DI water, is disposed on the base. The scrubber locates inside the cup and contacts the DI water when it locates in the second position. The oscillator is disposed at the cup, and it vibrates the DI water when the scrubber locates inside the cup and is contact with the DI water.

Abstract: A scrubbing assembly for a wafer-cleaning device is provided. The wafer-cleaning device is provided with a base. The scrubbing assembly comprises a scrubber, a cup and an oscillator. The scrubber is disposed on the base in a manner such that it can move between a first position and a second position. The scrubber scrubs a wafer when it locates in the first position. The cup, for receiving DI water, is disposed on the base. The scrubber locates inside the cup and contacts the DI water when it locates in the second position. The oscillator is disposed at the cup, and it vibrates the DI water when the scrubber locates inside the cup and is contact with the DI water.

Abstract: An apparatus and a method for cleaning wafers are provided. The apparatus for cleaning wafers comprises a first arm, a second arm, a water-supplying device, a measuring device, a transmitting device, and a brushing device. The water-supplying device supplies water to the wafer through the second arm to clean the wafer. The measuring device continuously measures the electrical properties of the water, after cleaning the wafer, and outputs a first signal. The transmitting device receives the first signal and outputs a second signal to the water-supplying device to continue cleaning the wafer when the first signal does not reach a set value and outputs a third signal to the water-supplying device to cease cleaning when the first signal reaches a set value. The brushing device, disposed on the first arm, brushes the wafer when the water is supplied to the wafer. By measuring the electrical properties of the water after cleaning, the invention directly monitors the cleanliness of the wafer.

Abstract: An apparatus for drying wafers has at least one rotatable cylinder in addition to a plurality of wafer slots. A wafer is supported in a slot by means of a plurality of wafer holders. The rotatable cylinder is in contact with the edge of a wafer. By rotating the rotatable cylinder, a wafer is also rotated. An isopropanol vapor flows through a wafer surface. Because of the wafer rotation, the isopropanol vapor flows through the wafer surface in different directions so that water drops or moistures can be carried away from the wafer and dried thoroughly.