Abstract: A light emitting element includes an emission stacked pattern and an insulating film. The emission stack pattern includes a first conductive semiconductor layer, an active layer disposed on the first conductive semiconductor layer, and a second conductive semiconductor layer disposed on the active layer. The insulating film surrounds an outer surface of the emission stacked pattern and has a non-uniform thickness.

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract: A pixel includes a first light source including at least one first light emitting element between a first split electrode and a second power supply; a second light source unit including at least one second light emitting element between a second split electrode and the second power supply; a driving-current generator including a first transistor between a first power supply and the first and second light source units and generating a driving current corresponding to a first data signal; a first switching unit including a first switching element between the driving-current generator and the first light source; and a second switching unit including a second switching element between the driving-current generator and the second light source unit and controlling an electrical connection between the first and second light source units in response to a second data signal.

Abstract: A pixel comprising a light emitting unit comprising at least one light emitting element; a pixel circuit for supplying current to the light emitting in response to a data signal; a sensing transistor electrically connected between a data line and a first node that is a common node of the light emitting unit and the pixel circuit; and a control transistor electrically connected between a scanning line and a gate electrode of the sensing transistor.

Abstract: A method of manufacturing a display panel includes providing a mother substrate in which a plurality of display cell areas is defined from which the display panel will be formed, the display cell areas arranged in along first and directions and each include a display unit cell corresponding to the display panel, and a dummy area extended along the second direction from the display unit cell dividing the mother substrate into the display unit cells each having the dummy area extended therefrom, by performing a wheel cutting process; separating the dummy area from the divided display unit cell by performing a laser cutting process; and curving the display unit cell from which the dummy area is separated, with reference to a reference axis which is parallel to the second direction, to form the display panel.

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract: A display device including: a display panel including a first substrate and a second substrate that are coupled to and face each other; a first polarizing plate attached to the second substrate of the display panel; a second polarizing plate attached to the first substrate of the display panel; and a side cover layer. The first polarizing plate has a first extended portion that extends outwardly beyond an end portion of the second substrate, and the second polarizing plate has a second extended portion that extends outwardly beyond an end portion of the first substrate. The side cover layer is between the first and second extended portions of the first and second polarizing plates and covers a first side surface of the first substrate and a second side surface of the second substrate that are near the first and second extended portions, respectively.

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract: A display device including: a display panel including a first substrate and a second substrate that are coupled to and face each other; a first polarizing plate attached to the second substrate of the display panel; a second polarizing plate attached to the first substrate of the display panel; and a side cover layer. The first polarizing plate has a first extended portion that extends outwardly beyond an end portion of the second substrate, and the second polarizing plate has a second extended portion that extends outwardly beyond an end portion of the first substrate. The side cover layer is between the first and second extended portions of the first and second polarizing plates and covers a first side surface of the first substrate and a second side surface of the second substrate that are near the first and second extended portions, respectively.

Abstract: A method of manufacturing a display panel includes providing a mother substrate in which a plurality of display cell areas is defined from which the display panel will be formed, the display cell areas arranged in along first and directions and each include a display unit cell corresponding to the display panel, and a dummy area extended along the second direction from the display unit cell dividing the mother substrate into the display unit cells each having the dummy area extended therefrom, by performing a wheel cutting process; separating the dummy area from the divided display unit cell by performing a laser cutting process; and curving the display unit cell from which the dummy area is separated, with reference to a reference axis which is parallel to the second direction, to form the display panel.

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract: A curved display apparatus includes a curved display panel, a driver, a controller and a plurality of flexible substrates. The curved display panel extends in a tangential direction with respect to a first axis direction. The driver applies a driving signal to the curved display panel. The controller includes a curved printed circuit board extending in the tangential direction with respect to a first axis direction. The controller applies a control signal to the driver. The flexible substrates electrically connect the curved printed circuit board with the curved display panel. Each of the flexible substrates includes a first connection portion connected to the curved display panel, a second connection portion connected to the curved printed circuit board and a flexible substrate body connecting the first connection portion with the second connection portion. The flexible substrate body extends in a radial direction with respect to the first axis direction.

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract: A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract: A curved display apparatus includes a curved display panel, a driver, a controller and a plurality of flexible substrates. The curved display panel extends in a tangential direction with respect to a first axis direction. The driver applies a driving signal to the curved display panel. The controller includes a curved printed circuit board extending in the tangential direction with respect to a first axis direction. The controller applies a control signal to the driver. The flexible substrates electrically connect the curved printed circuit board with the curved display panel. Each of the flexible substrates includes a first connection portion connected to the curved display panel, a second connection portion connected to the curved printed circuit board and a flexible substrate body connecting the first connection portion with the second connection portion. The flexible substrate body extends in a radial direction with respect to the first axis direction.

Abstract: A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate, The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line, The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract: A display apparatus includes a display panel, a light source part, a light source driving part and a used time calculation part. The light source part includes a light source providing the display panel with lights. The light source driving part includes a boost part outputting a light source driving voltage and a light source driving chip controlling the boost part. The used time calculation part detects an initial drive time during which an initial driving voltage is supplied to the light source driving chip and a normal drive time during which a normal driving voltage is supplied to the light source driving chip, and calculates a used time of the light source by using the initial drive time and the normal drive time. Thus, a real used time of a light source may be provided to correctly estimate lifetime of a light source.

Abstract: A display apparatus includes a display panel, a light source part, a light source driving part and a used time calculation part. The light source part includes a light source providing the display panel with lights. The light source driving part includes a boost part outputting a light source driving voltage and a light source driving chip controlling the boost part. The used time calculation part detects an initial drive time during which an initial driving voltage is supplied to the light source driving chip and a normal drive time during which a normal driving voltage is supplied to the light source driving chip, and calculates a used time of the light source by using the initial drive time and the normal drive time. Thus, a real used time of a light source may be provided to correctly estimate lifetime of a light source.