Patents by Inventor Su Mi Sam

Su Mi Sam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12278175
    Abstract: Some embodiments include apparatuses and electrical models associated with the apparatus. One of the apparatuses includes an integrated circuit having a die; a package substrate; first conductive connections coupled between the die and a first side of the package substrate; second conductive connections located on a second side of the package substrate opposite from the first side. The second conductive connections are coupled to the first conductive connections through conductive paths in the package substrate. The first conductive connections and the conductive connections are associated with an S-parameter of an electrical model of the integrated circuit package. The electrical model further includes at least one of a current value associated with a power rail of the integrated circuit package, an impedance target associated with a location at the integrated circuit package, and a mapping associated with the first and second conductive connections.
    Type: Grant
    Filed: June 26, 2021
    Date of Patent: April 15, 2025
    Assignee: Intel Corporation
    Inventors: Xing Jian Cai, Chi-Te Chen, Wei Qian, Yihong Yang, Jue Chen, Long Wang, Chung-Hao Joseph Chen, Su Mi Sam, Srinivas Thota
  • Publication number: 20210327801
    Abstract: Some embodiments include apparatuses and electrical models associated with the apparatus. One of the apparatuses includes an integrated circuit having a die; a package substrate; first conductive connections coupled between the die and a first side of the package substrate; second conductive connections located on a second side of the package substrate opposite from the first side. The second conductive connections are coupled to the first conductive connections through conductive paths in the package substrate. The first conductive connections and the conductive connections are associated with an S-parameter of an electrical model of the integrated circuit package. The electrical model further includes at least one of a current value associated with a power rail of the integrated circuit package, an impedance target associated with a location at the integrated circuit package, and a mapping associated with the first and second conductive connections.
    Type: Application
    Filed: June 26, 2021
    Publication date: October 21, 2021
    Inventors: Xing Jian Cai, Chi-Te Chen, Wei Qian, Yihong Yang, Jue Chen, Long Wang, Chung-Hao Joseph Chen, Su Mi Sam, Srinivas Thota
  • Publication number: 20040145376
    Abstract: A method according to one embodiment may include transmitting, via a network, to a node comprised in the network a relatively small portion of a signal propagated via a first buried transmission line. The network may be coupled to the transmission line and may be at least partially buried. The node may be capable of being coupled to a device that is capable of determining, based at least in part upon one or more characteristics of the relatively small portion of the signal received at the node, one or more characteristics of the signal propagated via the transmission line. The relatively small portion of the signal may have a magnitude that is relatively small compared to a magnitude of the signal. Of course, many modifications and variations are possible without departing from this embodiment.
    Type: Application
    Filed: January 24, 2003
    Publication date: July 29, 2004
    Inventor: Su Mi Sam