Patents by Inventor SU-Ml MOON

SU-Ml MOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHIP ON FILM PACKAGE AND DISPLAY APPARATUS HAVING THE SAME
    Publication number: 20170261799
    Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.
    Type: Application
    Filed: May 25, 2017
    Publication date: September 14, 2017
    Inventors: CHONG-GUK LEE, JOO-YEON WON, SE-HUI JANG, SU-Ml MOON, DONG-WOOK LEE