Patents by Inventor Su-Seng Pang

Su-Seng Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040067335
    Abstract: A composition of matter and method for inducing the rapid strengthening of damaged structures (e.g., buildings, bridges, dams, etc.) by reducing the application and curing times without the need to apply heat and pressure. The composition of matter comprises a strengthening fabric and a bonding agent which may be cured with ultraviolet light, such as sunlight, in less than about 30 min. The strengthening fabric comprises fibers chemically compatible with the bonding agent, and oriented to allow the bonding agent to quickly diffuse through the fabric.
    Type: Application
    Filed: October 7, 2002
    Publication date: April 8, 2004
    Inventors: Guoqiang Li, Su-Seng Pang
  • Patent number: 5031846
    Abstract: Apparatus for the formation of laminar, fiber-reinforced resin composite tubes of elbow shape. The apparatus, a filament winding machine, is employed by winding a continuous strand, or plurality of strands, of a resin-wetted yarn, roving, or filament about an elbow-shaped mold. The apparatus combination is constituted of a hollow shaft of curvilinear shape on which an elbow-shaped mold can be telescopically mounted. The two terminal ends of the hollow shaft can be journalled in place and the hollow shaft rotated thereabout. The combination also includes a sprocket-supported chain and connecting cable, the cable portion of which passes through the interior of the hollow shaft. The two terminal ends of the cable can be connected to the mold when the latter is mounted thereon so that reciprocal movement of the chain and cable can oscillate the mold upon the hollow curvilinear shaft as the shaft is rotated.
    Type: Grant
    Filed: June 29, 1989
    Date of Patent: July 16, 1991
    Inventors: Richard H. Lea, Su-Seng Pang, Ivan Curiel, Rajiv Jindia, Lloyd McClatchey