Patents by Inventor Su-Tai Yang

Su-Tai Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe with die pad and leads corresponding thereto
    Patent number: 7812431
    Abstract: A leadframe includes a die pad and a plurality of leads corresponding to the die pad. The die pad for supporting a die is formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion. The leads are substantially coplanar to the die pad. The leads include a plurality of first leads and a plurality of second leads. The first leads extend into the recess portions respectively, and the second leads are aligned with the protrusion portions. The length of the first leads is greater than that of the second leads. The length of wires electrically connecting the die to the leads or the die pad can be adjusted by the sides of the leadframe with the recess portion and the protrusion portion having a dimension corresponding to the leads, so as to save the manufacture cost of the leadframe.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: October 12, 2010
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Su-Tai Yang, Kuang-Chun Chou, Wen-Chi Cheng
  • LEADFRAME WITH DIE PAD AND LEADS CORRESPONDING THERETO
    Publication number: 20080303128
    Abstract: A leadframe includes a die pad and a plurality of leads corresponding to the die pad. The die pad for supporting a die is formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion. The leads are substantially coplanar to the die pad. The leads include a plurality of first leads and a plurality of second leads. The first leads extend into the recess portions respectively, and the second leads are aligned with the protrusion portions. The length of the first leads is greater than that of the second leads. The length of wires electrically connecting the die to the leads or the die pad can be adjusted by the sides of the leadframe with the recess portion and the protrusion portion having a dimension corresponding to the leads, so as to save the manufacture cost of the leadframe.
    Type: Application
    Filed: June 5, 2008
    Publication date: December 11, 2008
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Su-Tai Yang, Kuang-Chun Chou, Wen-Chi Cheng