Patents by Inventor Su Yang

Su Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230345835
    Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first electrode; a semiconductor structure disposed on the first electrode; and a second electrode disposed on the semiconductor structure, wherein the bottom surface of the second electrode includes an overlap area vertically overlapping the first electrode, the semiconductor structure includes a top surface opposite to the second electrode, and the center of the top surface of the semiconductor structure is arranged to be offset from the center of the overlap area.
    Type: Application
    Filed: September 17, 2021
    Publication date: October 26, 2023
    Inventors: Myoung Lae ROH, Tae Su YANG
  • Patent number: 11795572
    Abstract: A method of manufacturing a silicon carbide ingot, includes a preparing operation of adjusting internal space of a reactor in which silicon carbide raw materials and a seed crystal are disposed to have a high vacuum atmosphere, a proceeding operation of injecting an inert gas into the internal space, heating the internal space by moving a heater surrounding the reactor to induce the silicon carbide raw materials to sublimate, and growing the silicon carbide ingot on the seed crystal, and a cooling operation of cooling the temperature of the internal space to room temperature. The moving of the heater has a relative position which becomes more distant at a rate of 0.1 mm/hr to 0.48 mm/hr based on the seed crystal.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: October 24, 2023
    Assignee: SENIC INC.
    Inventors: Byung Kyu Jang, Jong Hwi Park, Eun Su Yang, Jung Woo Choi, Sang Ki Ko, Kap-Ryeol Ku, Jung-Gyu Kim
  • Publication number: 20230337541
    Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first substrate; a first insulating layer disposed on the first substrate; a second insulating layer disposed on the first insulating layer; a first electrode disposed on the second insulating layer; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; and a second substrate disposed on the second electrode, wherein the composition of the first insulating layer is different from the composition of the second insulating layer, the first insulating layer includes a first region disposed on the first substrate and a second region disposed between the first region and the second insulating layer, and a particle size (D50) of an inorganic filler included in the second region is greater than the particle size (D50) of an inorganic filler included in the first region.
    Type: Application
    Filed: September 16, 2021
    Publication date: October 19, 2023
    Inventors: Tae Su YANG, Boone Won, Seung LEE
  • Patent number: 11758811
    Abstract: A thermoelectric module according to one embodiment of the present invention comprises: a first metal substrate; a thermoelectric element; and a second metal substrate, wherein the thermoelectric element comprises a first resin layer, a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a plurality of second electrodes and a second resin layer, wherein the width of the first metal substrate is greater than the width of the second metal substrate, and the first metal substrate comprises a first surface in direct contact with the first resin layer and a second surface opposite to the first surface, and further comprises: a first support spaced apart from the thermoelectric element and a side surface of the second metal substrate on the first surface of the first metal substrate, and arranged so as to surround the thermoelectric element and the side surface of the second metal substrate; and a sealing material spaced apart from the thermoelectr
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: September 12, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Tae Su Yang
  • Publication number: 20230264176
    Abstract: A method for producing a catalyst for an electrochemical reaction that can be sized into fine particles while having a high specific surface area by using a carbon-based spacer in the catalyst synthesis process includes preparing a mixture by mixing a carbon-based spacer and a catalyst precursor and heat-treating the mixture.
    Type: Application
    Filed: December 15, 2022
    Publication date: August 24, 2023
    Inventor: Hee Su Yang
  • Patent number: 11737249
    Abstract: A multi-path cooling system is provided that includes a first cooling path in which a refrigerant is circulated by a first pump and a second cooling path in which the refrigerant is circulated by a second pump. A reservoir tank is provided through which the refrigerant circulating through the first cooling path enters or exits. An air separator is disposed on the second cooling path to separate air from the passing refrigerant when the refrigerant circulating through the second cooling path passes. The reservoir tank and the air separator communicate with each other.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: August 22, 2023
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Kyung Ho Kim, Sang Wan Kim, Dong Su Yang, Young Tae Yang
  • Publication number: 20230256003
    Abstract: A 2D TMD nanosheet functionalized with an amphiphilic block polymer compound of the present disclosure has scavenging activity for intracellular and mitochondrial ROS and the scavenging activity is maintained well at low pH, and further, inhibits the excessively increased secretion of inflammatory cytokines in microbial infection, exhibits antibacterial activity, and can increase survivability and prevent aggravation of symptoms in an animal model of sepsis, it can be provided as an anti-inflammatory/antioxidant agent for prevention and treatment of sepsis and septic shock.
    Type: Application
    Filed: June 24, 2021
    Publication date: August 17, 2023
    Inventors: Jong-Ho Kim, Chul-Su Yang, DaBin Yim
  • Publication number: 20230203107
    Abstract: Provided is an Rv3364c-derived peptide capable of directly binding to a BAR domain of SNX9. The Rv3364c-derived peptide of the present disclosure may regulate a TLR4-mediated inflammatory response depending on SNX9, and thus can be effectively applied to not only the use for the prevention and treatment of Mycobacterium tuberculosis infectious disease, but also the use for the prevention and treatment of sepsis and sepsis shock.
    Type: Application
    Filed: November 9, 2022
    Publication date: June 29, 2023
    Inventors: Chul Su YANG, Da Eun LEE
  • Patent number: 11646209
    Abstract: A method of cleaning a wafer comprises: a scrubbing operation comprising treating a target wafer to be cleaned with a brush at a rotation rate of 200 rpm or less to prepare a brush cleaned wafer; and a cleaning operation comprising cleaning the brush cleaned wafer with a cleaning solution to prepare a cleaned bare wafer, wherein the cleaning operation comprises a first cleaning operation and a second cleaning operation sequentially.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: May 9, 2023
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Il Hwan Yoo, Kap-Ryeol Ku, Jung-Gyu Kim, Jung Woo Choi, Eun Su Yang, Byung Kyu Jang, Sang Ki Ko
  • Patent number: 11612776
    Abstract: Systems and methods of an integrated fluid control valve and valve actuator assembly are provided. The assembly includes a pressure operated fluid control valve for controlling the flow of liquid from a liquid supply piping system into a sprinkler piping system of a fire protection system when transitioning the fire protection system from a stand-by state to an actuated state. The control valve defines a valve chamber for holding a pressurized fluid to prevent the flow of fluid through the control valve. A valve actuator is coupled to the fluid control valve housing for setting of the fluid control valve in an unactuated ready state and for operating the fluid control valve automatically and/or manually. The assembly has a common supply port to supply fluid to the control valve and the actuator and a common discharge port connected to multiple devices that can place the system in an actuated state.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: March 28, 2023
    Assignee: Tyco Fire Products LP
    Inventors: James O. Williams, Su Yang
  • Patent number: 11591711
    Abstract: A silicon carbide ingot producing method is provided. The method produces a silicon carbide ingot in which an internal space of a reactor is depressurized and heated to create a predetermined difference in temperature between upper and lower portions of the internal space. The method produces a silicon carbide ingot in which a plane of a seed crystal corresponding to the rear surface of the silicon carbide ingot is lost minimally. Additionally, the method produces a silicon carbide ingot with few defects and good crystal quality.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: February 28, 2023
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Eun Su Yang, Byung Kyu Jang, Jung Woo Choi, Sang Ki Ko, Kap-Ryeol Ku, Jung-Gyu Kim
  • Patent number: 11584629
    Abstract: A refrigerator for drinks is provided. The refrigerator may include a cabinet having a storage compartment therein, and a dispenser nozzle disposed to be at least partially exposed outside the cabinet. A pump connection line being able to increase pressure in a drink container by delivering high-pressure air into the drink container and a tank connection line preventing oxidation of the drink in the drink container by delivering an unreactive gas into the drink container may be disposed in the cabinet. Accordingly, two functions of discharging a drink and preventing oxidation may be individually performed, so consumption of an unreactive gas may be reduced.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: February 21, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Dae Woong Kim, Hee Su Yang, Min Kyu Oh, Su Young Lee, Ja Yoen Kim, Hwa Yun Choi
  • Publication number: 20230041393
    Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first buffer layer disposed on the first substrate, a first electrode disposed on the first buffer layer, a P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode, a second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg, a second buffer layer disposed on the second electrode, and a second substrate disposed on the second buffer layer, wherein at least one of the first buffer layer and the second buffer layer includes a silicone resin and an inorganic material, and the Young's modulus of at least one of the first buffer layer and the second buffer layer is 1 to 65 MPa.
    Type: Application
    Filed: December 16, 2020
    Publication date: February 9, 2023
    Inventors: Seung Hwan LEE, Tae Su YANG
  • Publication number: 20230031499
    Abstract: Methods and compositions capable of modulating activity of TLX (NR2E1), a nuclear receptor essential for neural stem cell self-renewal are provided. The modulation may comprise downregulating TLX expression and/or modulating TET3. In addition, methods of delivering shRNAs using dendrimer nanoparticles into glioblastoma stem cells are provided. The methods and compositions are useful for treating and preventing the progression of brain cancer, e.g., glioblastoma.
    Type: Application
    Filed: May 11, 2022
    Publication date: February 2, 2023
    Inventors: Yanhong Shi, Qi Cui, Su Yang
  • Publication number: 20230029782
    Abstract: A method for temperature control includes: acquiring the present temperature of a reaction window in a process chamber of a semiconductor machine; comparing the present temperature with the preset temperature to acquire a comparison result; and adjusting the exhaust amount of an exhaust passage of the process chamber based on the comparison result to control the temperature of the reaction window.
    Type: Application
    Filed: January 12, 2022
    Publication date: February 2, 2023
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Guoqing ZHANG, Su YANG, Duocai SUN, Xingfeng HONG, Yiqun LI
  • Patent number: 11566344
    Abstract: A wafer having relaxation moduli different by 450 GPa or less, as determined by dynamic mechanical analysis, when loaded to 1 N and 18 N with a loading rate of 0.1 N/min at a temperature of 25° C.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: January 31, 2023
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Jongmin Shim, Eun Su Yang, Yeon Sik Lee, Byung Kyu Jang, Jung Woo Choi, Sang Ki Ko, Kap-Ryeol Ku, Jung-Gyu Kim
  • Publication number: 20220407436
    Abstract: An ionic hydrogel moisture-electric generator including a thin film comprising a first surface and a second surface opposite to the first surface; a first electrode electrically connected to the first surface of the thin film; a second electrode electrically connected to the second surface of the thin film; and a moisture impermeable barrier film disposed on the second surface of the thin film, wherein the thin film comprises a hydrogel comprising at least one hydrophilic polymer, an ionic species, and a solvent; the ionic species is an acid or a salt; and the solvent includes a hygroscopic liquid.
    Type: Application
    Filed: June 9, 2022
    Publication date: December 22, 2022
    Inventors: Xiao-ming Tao, Su Yang
  • Publication number: 20220378893
    Abstract: The present disclosure is the first to identify a host cell protein and its function with which MPT63 and MPT64, secreted antigens of Mycobacterium tuberculosis, interact, and to construct a recombinant MPT protein including each domain of MPT63 and MPT64 interacting with the host cell protein, and the recombinant MPT protein may be applied to a use for the prevention and treatment of tuberculosis by confirming that the recombinant MPT protein targets the Mycobacterium tuberculosis-infected macrophages and increases the ROS level and inflammatory cytokine expression in macrophages, thereby inducing the death of Mycobacterium tuberculosis. And MPT protein of the present disclosure can improve the vaccine effect by the BCG vaccine so that it can be used as a tuberculosis vaccine and/or vaccine adjuvant either alone or together with known tuberculosis vaccines.
    Type: Application
    Filed: May 4, 2022
    Publication date: December 1, 2022
    Inventors: Chul-Su Yang, Jae-Sung Kim
  • Patent number: 11492376
    Abstract: The present invention relates to a novel Toxoplasma gondii GRA8-derived recombinant peptide, and a pharmaceutical composition and functional food for preventing or treating cancer, which includes the same as an active ingredient. The Toxoplasma gondii GRA8-derived recombinant peptide according to the present invention is a novel recombinant peptide in which a specific mitochondrial targeting sequence and an ATP5A1/SIRT3 sequence of GRA8 are conjugated to an acidity-triggered rational membrane (ATRAM), and has considerably improved efficacy in which an inhibitory concentration 50 (IC50) is improved up to 200-fold (in vitro) or 500-fold (in vivo), compared with a conventional GRA8-derived peptide (rGRA8). In addition, since the peptide treatment shows a notably distinct therapeutic effect in mouse models with cancer, the peptide may be effectively used in a pharmaceutical composition or functional food for preventing or treating cancer.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: November 8, 2022
    Assignee: Industry-University Cooperation Foundation Ranyang University Erica Campus
    Inventors: Chul-Su Yang, Jae-Sung Kim
  • Publication number: 20220351996
    Abstract: The application relates to the technical field of semiconductor manufacturing, and in particular relates to a front opening unified pod, a wafer transfer system and a wafer transfer method. The front opening unified pod includes a body, a wafer scanning device and a cover. The body is provided with an opening communicating with an interior of the body. The wafer scanning device includes a first wafer scanning device, is arranged on an inner wall of the body, and is configured to scan a storage condition of wafers in the body. The cover is fastened at the opening. The wafer scanning device is arranged on the inner wall of the body of the front opening unified pod, and the wafer scanning device scans and confirms the storage condition of the wafers in the front opening unified pod in real time.
    Type: Application
    Filed: February 9, 2022
    Publication date: November 3, 2022
    Inventors: Yanbin LI, Su Yang, Xingfeng Hong, Yiqun Li