Abstract: Provided are a reverse-reflow core, a semiconductor package, and a method of fabricating a semiconductor package. The semiconductor package includes: a semiconductor apparatus including a bump pad; and a bump portion bonded to the bump pad. The bump portion includes: a core; an intermetallic compound layer formed on the core; and a solder layer coating the intermetallic compound layer, wherein the thickness of a portion of the solder layer decreases as the distance between the portion of the solder layer and the bump pad increases. The reverse-reflow core, the semiconductor package, and the method of fabricating a semiconductor package enable the fabrication of a semiconductor package having high bonding strength and a high degree of precision.

Abstract: Provided is a metal ball fabricating apparatus for fabricating a metal ball by melting a material. The metal ball fabricating apparatus includes: a fabricating unit configured to fabricate a metal ball; and a collecting unit configured to collect the metal ball. The fabricating unit includes: a chamber configured to receive and store a material; a heating unit configured to apply heat to melt the material in the chamber; an orifice disposed at a lower portion of the chamber to which a metal ball droplet drops; a piston disposed over the orifice to generate a metal ball droplet; and a purifying system configured to remove a foreign substance from the material.