Patents by Inventor Su-Young Oh

Su-Young Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959819
    Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: April 16, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Su Jae Lee, Seong Hyun Kim, Chan Woo Park, Jae Bon Koo, Bock Soon Na, Ji-Young Oh
  • Patent number: 11951207
    Abstract: The present invention provides a stable liquid pharmaceutical formulation containing: an antibody or its antigen-binding fragment; a surfactant; a sugar or its derivative; and a buffer. The stable liquid pharmaceutical formulation according to the present invention has low viscosity while containing a high content of the antibody, has excellent long-term storage stability based on excellent stability under accelerated conditions and severe conditions, and may be administered subcutaneously.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: April 9, 2024
    Assignee: Celltrion Inc.
    Inventors: Joon Won Lee, Won Yong Han, Su Jung Kim, Jun Seok Oh, So Young Kim, Su Hyeon Hong, Yeon Kyeong Shin
  • Publication number: 20240076788
    Abstract: Disclosed are an oxidizing electrode, a water electrolysis device including the same and a method for manufacturing the same. According to exemplary embodiments of the present disclosure, there is provided an oxidizing electrode with improved performance at low loadings of noble metals, especially, ruthenium (Ru) and iridium oxide, in which a ruthenium (Ru) layer and an iridium oxide layer formed on a substrate by electrodeposition in a sequential order are supported by electrochemical reaction rather than physical bonding.
    Type: Application
    Filed: January 18, 2023
    Publication date: March 7, 2024
    Inventors: Hyun S. PARK, Jong Hyun JANG, Hee-Young PARK, Su Ji LEE, Sung Jong YOO, Jin Young KIM, Jimin KONG, Jin-ho OH, So Young LEE
  • Patent number: 9295709
    Abstract: Provided is an anticancer composition, and particularly, a pharmaceutical composition for inhibiting cancer, which includes a microRNA-30b, microRNA-133a, or microRNA-202-5p inhibitor as an active ingredient. The pharmaceutical composition may suppress microRNA-30b, microRNA-133a, or microRNA-202-5p, thereby inhibiting proliferation of cancer cells, and eventually, is expected to be useful for cancer treatment.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: March 29, 2016
    Assignee: Kyungpook National University Industry-Academic Cooperation Foundation
    Inventors: You-Mie Lee, Su Young Oh
  • Publication number: 20150238564
    Abstract: Provided is an anticancer composition, and particularly, a pharmaceutical composition for inhibiting cancer, which includes a microRNA-30b, microRNA-133a, or microRNA-202-5p inhibitor as an active ingredient. The pharmaceutical composition may suppress microRNA-30b, microRNA-133a, or microRNA-202-5p, thereby inhibiting proliferation of cancer cells, and eventually, is expected to be useful for cancer treatment.
    Type: Application
    Filed: February 18, 2015
    Publication date: August 27, 2015
    Inventors: You-Mie Lee, Su Young Oh
  • Patent number: 8344431
    Abstract: An image sensor includes a light receiving device, a field effect transistor, a stress layer pattern, and a surface passivation material. The light receiving device is formed in a first region of a substrate. The field effect transistor is formed in a second region of the substrate. The stress layer pattern is formed over the field effect transistor for creating stress therein to improve transistor performance. The surface passivation material is formed on the first region of the substrate for passivating dangling bonds at the surface of the light receiving device.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: January 1, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyoun-Min Beak, Tae-Seok Oh, Jong-Won Choi, Su-Young Oh
  • Patent number: 8063496
    Abstract: A semiconductor integrated circuit device includes a semiconductor substrate including a main chip region and a pad region, a multi-layer pad structure on the pad region of the semiconductor substrate, a redistribution pad through the semiconductor substrate and in contact with a bottom surface of the multi-layer pad structure, the redistribution pad being electrically connected to the multi-layer pad structure, a trench belt through the semiconductor substrate and surrounding the redistribution pad, the trench belt electrically isolating the redistribution pad and a portion of the semiconductor substrate adjacent to the redistribution pad, and a connection terminal on the redistribution pad, the connection terminal electrically connecting the redistribution pad to an external source.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: November 22, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keon-Yong Cheon, Tae-Seok Oh, Jong-Won Choi, Su-Young Oh
  • Publication number: 20110260222
    Abstract: An image sensor includes a light receiving device, a field effect transistor, a stress layer pattern, and a surface passivation material. The light receiving device is formed in a first region of a substrate. The field effect transistor is formed in a second region of the substrate. The stress layer pattern is formed over the field effect transistor for creating stress therein to improve transistor performance. The surface passivation material is formed on the first region of the substrate for passivating dangling bonds at the surface of the light receiving device.
    Type: Application
    Filed: April 27, 2011
    Publication date: October 27, 2011
    Inventors: Hyoun-Min Beak, Tae-Seok Oh, Jong-Won Choi, Su-Young Oh
  • Patent number: 7955888
    Abstract: An image sensor includes a light receiving device, a field effect transistor, a stress layer pattern, and a surface passivation material. The light receiving device is formed in a first region of a substrate. The field effect transistor is formed in a second region of the substrate. The stress layer pattern is formed over the field effect transistor for creating stress therein to improve transistor performance. The surface passivation material is formed on the first region of the substrate for passivating dangling bonds at the surface of the light receiving device.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: June 7, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyoun-Min Beak, Tae-Seok Oh, Jong-Won Choi, Su-Young Oh
  • Publication number: 20100240058
    Abstract: Disclosed are a microRNA antisense PNA capable of inhibiting the activity or function of microRNA, a composition for inhibiting the activity or function of microRNA containing the same, a method for inhibiting the activity or function of microRNA using the same, and a method for evaluating the effectiveness thereof.
    Type: Application
    Filed: November 24, 2008
    Publication date: September 23, 2010
    Applicant: PANAGENE INC.
    Inventors: Hee Kyung Park, Su Young Oh
  • Publication number: 20090057735
    Abstract: An image sensor includes a light receiving device, a field effect transistor, a stress layer pattern, and a surface passivation material. The light receiving device is formed in a first region of a substrate. The field effect transistor is formed in a second region of the substrate. The stress layer pattern is formed over the field effect transistor for creating stress therein to improve transistor performance. The surface passivation material is formed on the first region of the substrate for passivating dangling bonds at the surface of the light receiving device.
    Type: Application
    Filed: August 29, 2008
    Publication date: March 5, 2009
    Inventors: Hyoun-Min Beak, Tae-Seok Oh, Jong-Won Choi, Su-Young Oh
  • Publication number: 20090057899
    Abstract: A semiconductor integrated circuit device includes a semiconductor substrate including a main chip region and a pad region, a multi-layer pad structure on the pad region of the semiconductor substrate, a redistribution pad through the semiconductor substrate and in contact with a bottom surface of the multi-layer pad structure, the redistribution pad being electrically connected to the multi-layer pad structure, a trench belt through the semiconductor substrate and surrounding the redistribution pad, the trench belt electrically isolating the redistribution pad and a portion of the semiconductor substrate adjacent to the redistribution pad, and a connection terminal on the redistribution pad, the connection terminal electrically connecting the redistribution pad to an external source.
    Type: Application
    Filed: August 28, 2008
    Publication date: March 5, 2009
    Inventors: Keon-Yong Cheon, Tae-Seok Oh, Jong-Won Choi, Su-Young Oh