Abstract: A flush glass apparatus includes an operation glass including a glass portion and a frame and configured to open and close an opening of a fixed glass, an upper rail having an upper guide groove configured to slidably support an upper portion of the operation glass, a lower rail having a lower guide groove configured to slidably support a lower portion of the operation glass, a locking device including an upper locking pin and a lower locking pin installed on upper and lower sides of the frame, respectively, to enter the upper and lower guide grooves, respectively, and lock or unlock the operation glass, and upper and lower removal guide members installed on the upper rail and the lower rail, respectively, and configured to guide the upper and lower locking pins to be removed from the upper and lower guide grooves by entering the upper or lower guide grooves.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a lower structure including a semiconductor chip having a chip terminal; an external connection terminal connecting the semiconductor chip to an external device; and an intermediate connection structure including an upper surface and a lower surface opposite to the upper surface, and positioned between the lower structure and the external connection terminal.

Abstract: A technical idea of the present disclosure provides a semiconductor package, as a semiconductor package mounted on a circuit board, including: a body portion including a semiconductor chip, and a first surface and a second surface opposite to each other; and a structure including n insulating layers stacked on at least one of the first surface and the second surface of the body portion, wherein the semiconductor package has a predetermined target coefficient of thermal expansion (CTE), and the n insulating layers and the body portion have a thickness and a CTE satisfying a condition that an effective CTE of the semiconductor package becomes equal to the predetermined target CTE.

Abstract: A semiconductor package having improved impact resistance and excellent heat dissipation and electromagnetic wave shielding property, and a manufacturing method thereof are provided. There is provided a semiconductor package including: a chip having a contact pad provided on one surface thereof; a buffer layer formed on one surface of the chip; one or more wiring patterns disposed on the buffer layer, electrically connected to the contact pad of the chip, and extended to an outside of the chip; an external pad provided on the wiring pattern and electrically connected to the wiring pattern; an external connection terminal electrically connected to the external pad; and a mold layer formed to surround the other surface and a side surface of the chip and a side surface of the buffer layer, and formed up to the other surface of the wiring pattern.

Abstract: A semiconductor package includes an upper structure including a semiconductor chip and a first molding layer for molding the semiconductor chip, a lower structure provided on the upper structure, the lower structure including a conductive post and a second molding layer for molding the conductive post, and a redistribution structure provided between the upper structure and the lower structure, the redistribution structure including a wiring pattern for electrically connecting a pad of the semiconductor chip to the conductive post, in which a thermal expansion coefficient of the second molding layer is different from a thermal expansion coefficient of the first molding layer.

Abstract: A semiconductor package includes a semiconductor chip including a chip pad, a first insulating layer provided on the semiconductor chip and including a first via hole, a first wiring pattern provided on the first insulating layer and connected to the chip pad through the first via hole of the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring pattern and including a second via hole, and a second wiring pattern provided on the second insulating layer and connected to the first wiring pattern through the second via hole of the second insulating layer, wherein the first insulating layer includes a first upper surface in contact with the second insulating layer and a first lower surface opposite to the first upper surface, and the first upper surface of the first insulating layer has surface roughness greater that the first lower surface of the first insulating layer.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a lower structure including a semiconductor chip having a chip terminal; an external connection terminal connecting the semiconductor chip to an external device, and an intermediate connection structure including an upper surface and a lower surface opposite to the upper surface, and positioned between the lower structure and the external connection terminal.

Abstract: A semiconductor package having improved impact resistance and excellent heat dissipation and electromagnetic wave shielding property, and a manufacturing method thereof are provided. There is provided a semiconductor package including: a chip having a contact pad provided on one surface thereof; a buffer layer formed on one surface of the chip; one or more wiring patterns disposed on the buffer layer, electrically connected to the contact pad of the chip, and extended to an outside of the chip; an external pad provided on the wiring pattern and electrically connected to the wiring pattern; an external connection terminal electrically connected to the external pad; and a mold layer formed to surround the other surface and a side surface of the chip and a side surface of the buffer layer, and formed up to the other surface of the wiring pattern.

Abstract: A conveying screw for a food waste disposal device that can stir, crush and cut food waste generated from homes or restaurants, while transferring the food waste, to reduce the amount of the food waste, includes a rotational shaft, and a plurality of spiral rotor blades installed to an outer peripheral surface of the rotational shaft in a spiral pattern to stir, crush and cut food waste. Each of the rotor blades is provided with a plurality of air supply holes penetrating the rotor blade to supply external air to the food waste between the opposite rotor blades, thereby generating bubbles from the food waste and then discharging vapor.

Abstract: The present invention provides a method for detecting heterozygous mutation using E. coli stop codon assay. The present invention further provides a gap vector used in the E. coli stop codon assay. According to this invention, the heterozygous mutation in certain gene, e.g. APC gene or BRCA1 gene, may be detected in simple and rapid manner, for example, visual observation on colonies.