Patents by Inventor Su Yun YUN

Su Yun YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12283431
    Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, first and second external electrodes respectively disposed on opposing surfaces of the body and connected to the first internal electrode, and a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode. One of the first and second external electrodes includes a first conductive resin layer, the first conductive resin layer includes first conductive particles including at least one of a first metal particle and a first intermetallic compound, and a first resin, and a ratio N1/N2 is 17% or more, in which N1 is the number of particles having a Feret diameter of 14 ?m or more, among the first conductive particles, and N2 is a total number of first conductive particles.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: April 22, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Su Yun Yun, Hong Je Choi, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Jung Min Kim
  • Publication number: 20240203656
    Abstract: An example embodiment of the present disclosure provides a multilayer electronic component including an external electrode including an electrode layer and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes conductive particles including at least one of Cu particles, Cu3Sn and Cu6Sn5, and a resin, and in cross-sections of the conductive resin layer, a ratio of an area occupied by Cu3Sn to the total area occupied by the Cu particles, Cu3Sn, and Cu6Sn5 is 1.88% to 38.89%, and a ratio of an area occupied by Cu6Sn5 to the total area occupied by the Cu particles, Cu3Sn and Cu6Sn5 is 31.54% to 97.23%.
    Type: Application
    Filed: April 26, 2023
    Publication date: June 20, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Jin PARK, Hong Je CHOI, Ji Hye HAN, Byung Woo KANG, Su Yun YUN, Sang Wook LEE, Jung Min KIM
  • Publication number: 20240194408
    Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, first and second external electrodes respectively disposed on opposing surfaces of the body and connected to the first internal electrode, and a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode. One of the first and second external electrodes includes a first conductive resin layer, the first conductive resin layer includes first conductive particles including at least one of a first metal particle and a first intermetallic compound, and a first resin, and a ratio N1/N2 is 17% or more, in which N1 is the number of particles having a Feret diameter of 14 ?m or more, among the first conductive particles, and N2 is a total number of first conductive particles.
    Type: Application
    Filed: April 7, 2023
    Publication date: June 13, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Su Yun YUN, Hong Je CHOI, Ji Hye HAN, Byung Woo KANG, Hye Jin PARK, Sang Wook LEE, Jung Min KIM
  • Publication number: 20240170219
    Abstract: A multilayer electronic component includes: a body having a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween in a first direction; and an external electrode including a connection portion and a band portion extending from the connection portion onto first and second surfaces of the body, wherein the external electrode further includes an electrode layer connected to one of the first and second internal electrodes, a resin layer in contact with the first and second surfaces, and a conductive resin layer disposed on the electrode layer and extending to the resin layer, and L1??L1 when L1 indicates a second-directional size of the resin layer in the band portion, and L1? indicates a second-directional size of the conductive resin layer in the band portion.
    Type: Application
    Filed: March 9, 2023
    Publication date: May 23, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Woo KANG, Jung Min KIM, Hong Je CHOI, Ji Hye HAN, Hye Jin PARK, Su Yun YUN, Sang Wook LEE