Patents by Inventor Sua LEE

Sua LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230419043
    Abstract: A conversation learning service method includes registering audio uttered by a first learning participant as pronunciation content in an accent that represents the first learning participant's country of origin, ethnicity, or region; and providing a conversational text including at least two sentences in a role-playing format using the pronunciation content corresponding to the sentence.
    Type: Application
    Filed: June 21, 2023
    Publication date: December 28, 2023
    Inventors: Sua LEE, Somi KIM, Jonghwan KIM, Hye Seung SEO, Dongwoon KIM, JeeHye SUNG, Yanchen ZHOU, Longri JIN
  • Publication number: 20230417748
    Abstract: Provided are a coronavirus spike (S) protein-specific antibody and use thereof.
    Type: Application
    Filed: November 5, 2021
    Publication date: December 28, 2023
    Inventors: Dong-Sik KIM, Sua LEE, Shin A JANG, Jihoon KANG, KI Joon CHO, Soo Bin PARK, Young Woo HAN, Hyemi NAM, Mi Young OH, Jee Boong LEE, Jihye RYU, Mun Kyung KIM, Jeewon LEE
  • Publication number: 20220251176
    Abstract: A fusion protein including a fragment of an anti-mesothelin antibody, an anti-CD3 antibody or an anti-EGFR antibody; a bispecific antibody that is specific to mesothelin and CD3; a trispecific antibody that is specific to mesothelin, CD3 and EGFR are provided. The fusion protein is effective in treating cancer. The bispecific or trispecific antibody can be prepared in a high yield and with high purity, and has excellent tumor killing and growth inhibitory effects, and thus can be effectively used in cancer treatment.
    Type: Application
    Filed: December 16, 2019
    Publication date: August 11, 2022
    Applicants: GREEN CROSS CORPORATION, MOGAM INSTITUTE FOR BIOMEDICAL RESEARCH
    Inventors: Yangmi LIM, Shinai LEE, Jonghwa WON, Yong-Yea PARK, Aerin YOON, Sua LEE, Okjae LIM, Sojung LIM, Munkyung KIM
  • Patent number: 11270992
    Abstract: A semiconductor device includes standard cells disposed in a first direction parallel to an upper surface of a substrate and a second direction intersecting the first direction, each standard cell including an active region, a gate structure disposed to intersect the active region, source/drain regions on the active region at both sides of the gate structure, and first interconnection lines electrically connected to the active region and the gate structures; filler cells disposed between at least portions of the standard cells, each filler cell including a filler active region and a filler gate structure disposed to intersect the filler active region; and a routing structure disposed on the standard cells and the filler cells and including second interconnection lines electrically connecting the first interconnection lines of different standard cells to each other, wherein the second interconnection lines includes a first line having a first width and a second line having a second width larger than the first
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: March 8, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaehoon Kim, Jun Seomun, Sua Lee, Hyungock Kim
  • Publication number: 20210134784
    Abstract: A semiconductor device includes standard cells disposed in a first direction parallel to an upper surface of a substrate and a second direction intersecting the first direction, each standard cell including an active region, a gate structure disposed to intersect the active region, source/drain regions on the active region at both sides of the gate structure, and first interconnection lines electrically connected to the active region and the gate structures; filler cells disposed between at least portions of the standard cells, each filler cell including a filler active region and a filler gate structure disposed to intersect the filler active region; and a routing structure disposed on the standard cells and the filler cells and including second interconnection lines electrically connecting the first interconnection lines of different standard cells to each other, wherein the second interconnection lines includes a first line having a first width and a second line having a second width larger than the first
    Type: Application
    Filed: August 13, 2020
    Publication date: May 6, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaehoon KIM, Jun SEOMUN, Sua LEE, Hyungock KIM