Patents by Inventor Suan Boon
Suan Boon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070264751Abstract: A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packages are provided. In one embodiment, the die package comprises a redistribution layer interconnecting two or more dies disposed on a substrate, typically a semiconductor wafer, the redistribution layer including a first trace connecting a bond pad of each of two dies, and a second trace connecting one of the bond pads of the two dies to a ball pad. The die package of the invention can comprise memory devices such as static random access memories (SRAMs), and can be incorporated into a variety of electronic systems as part of a memory package such as single in line memory modules (SIMMs) or dual in line memory modules.Type: ApplicationFiled: July 30, 2007Publication date: November 15, 2007Applicant: MICRON TECHNOLOGY, INC.Inventors: Yong Chia, Suan Boon, Siu Low, Yong Neo, Bok Ser
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Publication number: 20070152327Abstract: A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packages are provided. In one embodiment, the die package comprises a redistribution layer interconnecting two or more dies disposed on a substrate, typically a semiconductor wafer, the redistribution layer including a first trace connecting a bond pad of each of two dies, and a second trace connecting one of the bond pads of the two dies to a ball pad. The die package of the invention can comprise memory devices such as static random access memories (SRAMs), and can be incorporated into a variety of electronic systems as part of a memory package such as single in line memory modules (SIMMs) or dual in line memory modules.Type: ApplicationFiled: February 28, 2007Publication date: July 5, 2007Applicant: Micron Technology, Inc.Inventors: Yong Chia, Suan Boon, Siu Low, Yong Neo, Bok Ser
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Publication number: 20070145558Abstract: A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packages are provided. In one embodiment, the die package comprises a redistribution layer interconnecting two or more dies disposed on a substrate, typically a semiconductor wafer, the redistribution layer including a first trace connecting a bond pad of each of two dies, and a second trace connecting one of the bond pads of the two dies to a ball pad. The die package of the invention can comprise memory devices such as static random access memories (SRAMs), and can be incorporated into a variety of electronic systems as part of a memory package such as single in line memory modules (SIMMs) or dual in line memory modules.Type: ApplicationFiled: February 28, 2007Publication date: June 28, 2007Applicant: Micron Technology, Inc.Inventors: Yong Chia, Suan Boon, Siu Low, Yong Neo, Bok Ser
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Publication number: 20070059862Abstract: A semiconductor device package and method of fabricating the same. The semiconductor device package may include a variety of semiconductor dice, thereby providing a system on a chip solution. The semiconductor dice are attached to connection locations associated with a conductive trace layer such as through flip-chip technology. A plurality of circuit connection elements is also coupled to the conductive trace layer, either directly or through additional, intervening conductive trace layers. An encapsulation layer may be formed over the dice and substrate. Portions of the circuit connection elements remain exposed through the encapsulation layer for connection to external devices. A plurality of conductive bumps may be formed, each conductive bump being disposed atop an exposed portion of a circuit connection element, to facilitate electrical connection with an external device.Type: ApplicationFiled: November 9, 2006Publication date: March 15, 2007Inventors: Meow Eng, Yong Chia, Yong Neo, Suan Boon, Siu Low, Swee Chua, Shuangwu Huang
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Publication number: 20060261493Abstract: Flip chip packages formed at a wafer level on semiconductor wafers for electronic systems provide convenient prepackaging. The package, in one embodiment, includes an adhesive layer applied to an active side of the wafer. The adhesive layer has openings to permit access to the conductive pads on each die. A conductive material substantially fills the openings. A pre-packaged die diced from the semiconductor wafer is mounted to a support wherein the conductive material effects electrical interconnection between the conductive pads on the die and receiving conductors on the support. The pre-packaged die can be coupled to a processor for an electronic system. To provide greater mounting densities, two or more dice may be coupled with the adhesive layer providing a covering for the two or more dice. The prepackaged chip with two or more dice may be coupled to a processor reducing the volume needed in an electronic system.Type: ApplicationFiled: July 27, 2006Publication date: November 23, 2006Inventor: Suan Boon
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Publication number: 20060261475Abstract: Methods for producing a flip chip package by prepackaging one or more dice on a semiconductor wafer are provided. An embodiment of the method includes applying an adhesive to a first side of a finished wafer, where a number of dice are located. The active layer of the dice is on the first side of the finished wafer. The method further includes forming an array of conductive elements within the adhesive, where the array of conductive elements is electrically coupled to an array of connection pads on a die. The wafer can be diced to provide pre-packaged chips. To provide greater mounting densities, two or more dice may be coupled before application of the adhesive layer.Type: ApplicationFiled: July 26, 2006Publication date: November 23, 2006Inventor: Suan Boon
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Publication number: 20060255475Abstract: Flip chip packages formed at a wafer level on semiconductor wafers for electronic systems provide convenient prepackaging. The package, in one embodiment, includes an adhesive layer applied to an active side of the wafer. The adhesive layer has openings to permit access to the conductive pads on each die. A conductive material substantially fills the openings. A pre-packaged die diced from the semiconductor wafer is mounted to a support wherein the conductive material effects electrical interconnection between the conductive pads on the die and receiving conductors on the support. The pre-packaged die can be coupled to a processor for an electronic system. To provide greater mounting densities, two or more dice may be coupled with the adhesive layer providing a covering for the two or more dice. The prepackaged chip with two or more dice may be coupled to a processor reducing the volume needed in an electronic system.Type: ApplicationFiled: July 27, 2006Publication date: November 16, 2006Inventor: Suan Boon
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Publication number: 20060258052Abstract: Methods for producing a flip chip package by prepackaging one or more dice on a semiconductor wafer are provided. An embodiment of the method includes applying an adhesive to a first side of a finished wafer, where a number of dice are located. The active layer of the dice is on the first side of the finished wafer. The method further includes forming an array of conductive elements within the adhesive, where the array of conductive elements is electrically coupled to an array of connection pads on a die. The wafer can be diced to provide pre-packaged chips. To provide greater mounting densities, two or more dice may be coupled before application of the adhesive layer.Type: ApplicationFiled: July 26, 2006Publication date: November 16, 2006Inventor: Suan Boon
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Publication number: 20060038778Abstract: An electromechanical information browsing device that controls page flipping actions of information displayed as an e-book on a display device. The browsing device includes a controller that provides tactile feedback so as to lessen the user-interface differences between conventional books and e-books. Sensors and control mechanisms in the controller generate a series of electrical signals that are interpreted by the computer that displays the e-book to control various browsing operations, such as flipping pages, controlling a rate of page flipping, jumping to pre-set locations in the e-book, etc.Type: ApplicationFiled: October 27, 2005Publication date: February 23, 2006Applicant: E-BOOK SYSTEMS PTE LTDInventors: Suan Boon, Seng Beng Ho, Chee Cheng Liang
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Publication number: 20060006521Abstract: A sacrificial for fabricating semiconductor device assemblies and packages with edge contacts includes conductive elements on a surface thereof, which are located so as to align along a street between each adjacent pair of semiconductor devices on the device substrate. A semiconductor device assembly or package includes a semiconductor device, a redistribution layer over an active surface of the semiconductor device, and dielectric material coating at least portions of an outer periphery of the semiconductor device. Peripheral sections of contacts are located on the peripheral edge and electrically isolated therefrom by the dielectric coating. The contacts may also include upper sections that extend partially over the active surface of the semiconductor device. The assembly or package may include any type of semiconductor device, including a processor, a memory device, and emitter, or an optically sensitive device.Type: ApplicationFiled: August 29, 2005Publication date: January 12, 2006Inventors: Suan Boon, Yong Chia, Meow Eng, Siu Low
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Publication number: 20060001143Abstract: Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled to castellation blocks and, depending on the embodiment, input/output pads. The castellation blocks and input/output pads are encapsulated and held in place by an encapsulant. When the devices are being fabricated, the castellation blocks and input/output pads are sawed through. If necessary, the wafer portion on which the devices are fabricated may be thinned. The packages may be used as a leadless chip carrier package or may be stacked on top of one another. When stacked, the respective contacts of the packages are preferably coupled. Data may be written to, and received from, packaged chips when a chip is activated. Chips may be activated by applying the appropriate signal or signals to the appropriate contact or contacts.Type: ApplicationFiled: September 7, 2005Publication date: January 5, 2006Inventors: Suan Boon, Yong Chia, Siu Low, Meow Eng, Swee Chua, Shuang Huang, Yong Neo, Wei Zhou
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Publication number: 20050236709Abstract: A semiconductor device package and method of fabricating the same. The semiconductor device package may include a variety of semiconductor dice, thereby providing a system on a chip solution. The semiconductor dice are attached to connection locations associated with a conductive trace layer such as through flip-chip technology. A plurality of circuit connection elements is also coupled to the conductive trace layer, either directly or through additional, intervening conductive trace layers. An encapsulation layer may be formed over the dice and substrate. Portions of the circuit connection elements remain exposed through the encapsulation layer for connection to external devices. A plurality of conductive bumps may be formed, each conductive bump being disposed atop an exposed portion of a circuit connection element, to facilitate electrical connection with an external device.Type: ApplicationFiled: June 30, 2005Publication date: October 27, 2005Inventors: Meow Eng, Yong Chia, Yong Neo, Suan Boon, Siu Low, Swee Chua, Shuangwu Huang
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Publication number: 20050073029Abstract: The present invention defines a packaging implementation providing a multichip multilayer system on a chip solution. Greater integration of a plurality and variety of known good die contained within cavities formed in a separate substrate is achieved. Additional redistribution and interconnect layers above the multichip configuration may be formed with the redistribution layers terminating in electrical connections such as conductive bumps or balls. In one embodiment, the substrate cavities receive signal device connections, such as conductive bumps, of a plurality of semiconductor dice in a flip-chip configuration. A portion of the substrate's back surface is then removed to a depth sufficient to expose the conductive bumps. In another embodiment, the cavities receive the semiconductor dice with their active surface facing up wherein metal layer connections are formed and coupled to bond pads or other electrical connectors of the semiconductor dice.Type: ApplicationFiled: November 30, 2004Publication date: April 7, 2005Inventors: Swee Chua, Siu Low, Yong Chia, Meow Eng, Yong Neo, Suan Boon, Shuangwu Huang, Wei Zhou
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Publication number: 20050067680Abstract: A method for fabricating a chip-scale package includes securing a device substrate that carries at least two adjacent semiconductor devices to a sacrificial substrate. The sacrificial substrate may include conductive elements on a surface thereof, which are located so as to align along a street between each adjacent pair of semiconductor devices on the device substrate. The device substrate is then severed along each street and the newly formed peripheral edge of each semiconductor device coated with dielectric material. If the sacrificial substrate includes conductive elements, they may be exposed between adjacent semiconductor devices and subsequently serve as lower sections of contacts. Peripheral sections of contacts are formed on the peripheral edge. Upper sections of the contacts may also be formed over the active surfaces of the semiconductor devices. Once the contacts are formed, the sacrificial substrate is substantially removed from the back sides of the semiconductor devices.Type: ApplicationFiled: November 19, 2003Publication date: March 31, 2005Inventors: Suan Boon, Yong Chia, Meow Eng, Siu Low
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Publication number: 20050048695Abstract: A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packages are provided. In one embodiment, the die package comprises a redistribution layer interconnecting two or more dies disposed on a substrate, typically a semiconductor wafer, the redistribution layer including a first trace connecting a bond pad of each of two dies, and a second trace connecting one of the bond pads of the two dies to a ball pad. The die package of the invention can comprise memory devices such as static random access memories (SRAMs), and can be incorporated into a variety of electronic systems as part of a memory package such as single in line memory modules (SIMMs) or dual in line memory modules.Type: ApplicationFiled: October 12, 2004Publication date: March 3, 2005Applicant: Micron Technology, Inc.Inventors: Yong Chia, Suan Boon, Siu Low, Yong Neo, Bok Ser
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Publication number: 20050006748Abstract: A semiconductor device package is disclosed. The semiconductor device package may include a variety of semiconductor dice, thereby providing a system on a chip solution. The semiconductor dice are attached to connection locations associated with a conductive trace layer such as through flip-chip technology. A plurality of circuit connection elements is also coupled to the conductive trace layer, either directly or through additional, intervening conductive trace layers. An encapsulation layer may be formed over the dice and substrate. Portions of the circuit connection elements remain exposed through the encapsulation layer for connection to external devices. A plurality of conductive bumps may be formed, each conductive bump being disposed atop an exposed portion of a circuit connection element, to facilitate electrical connection with an external device.Type: ApplicationFiled: August 4, 2004Publication date: January 13, 2005Inventors: Meow Eng, Yong Chia, Yong Neo, Suan Boon, Siu Low, Swee Chua, Shuangwu Huang