Abstract: A low-profile, insert molded contact block and corresponding printed circuit board assembly are provided for coupling electronic circuitry disposed on printed wiring boards to external electronic devices. The contact block includes a plurality of L-shaped, metal contacts insert molded into a housing. The housing includes bracing members that circumscribe the metal contacts so that at least a portion of the front and rear faces of the metal contacts are exposed between the bracing members. The contact block may be coupled to a printed wiring board in an automated, reflow solder process utilizing automated pick and place equipment. The contact block is placed on the printed wiring board such that the metal contacts are seated on conductive pads with solder paste disposed thereon. The resulting assembly may then be heated in a reflow oven to permanently affix the metal contacts to the conductive pads. The contact block, which can be on the order of 0.

Abstract: A battery pack for an electronic communications device having electronic circuitry, at least one rechargeable cell, a housing and a circuit substrate is provided. Included within the pack is a copper strip that is electrically isolated from the battery circuitry. The copper strip is tuned by adjusting the length and width of the strip, as well as the placement of the strip within the battery pack, so as to reduce the overall Specific Absorption Rate (SAR) of the communications device-battery combination. In one preferred embodiment, the copper strip is 70 mm by 3 mm, made from 1 oz. copper, and formed into a “L” shape. The copper strip is placed along the side of the cell and about the end having the positive terminal. Overall SAR is reduced 13% by using the battery with the copper strip.