Patents by Inventor Suba Chithambaram Subramaniam

Suba Chithambaram Subramaniam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8513764
    Abstract: A Schottky diode including a semiconductor region, a first terminal comprising a metal or a metal silicide or being metallic, and a second terminal comprising at least a portion of the semiconductor region. The diode further includes an at least partly conductive material or a material capable of holding a charge in close proximity to, or in contact with, or surrounding one of the first and second terminals, a field insulator located at least partly in the semiconductor region, a dielectric region located over the semiconductor region between the field insulator and the one of the first and second terminals for isolating the conductive or charge-holding material from the semiconductor region, and wherein the dielectric region comprises insulating regions of different thicknesses.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: August 20, 2013
    Assignee: X-Fab Semiconductor Foundries AG
    Inventors: Paul R. Stribley, Suba Chithambaram Subramaniam
  • Publication number: 20120211859
    Abstract: A Schottky diode including a semiconductor region, a first terminal comprising a metal or a metal silicide or being metallic, and a second terminal comprising at least a portion of the semiconductor region. The diode further includes an at least partly conductive material or a material capable of holding a charge in close proximity to, or in contact with, or surrounding one of the first and second terminals, a field insulator located at least partly in the semiconductor region, a dielectric region located over the semiconductor region between the field insulator and the one of the first and second terminals for isolating the conductive or charge-holding material from the semiconductor region, and wherein the dielectric region comprises insulating regions of different thicknesses.
    Type: Application
    Filed: February 18, 2011
    Publication date: August 23, 2012
    Inventors: Paul R. Stribley, Suba Chithambaram Subramaniam