Patents by Inventor Subahu Desai

Subahu Desai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9007202
    Abstract: A human being tracking and monitoring system comprising parent and child units, each of which include a microcontroller, a transceiver, a crystal, a battery, a voltage regulator and a switch with all of these elements except the battery being strategically positioned on one side of a circuit board, manual activation of the two switches in a first predetermined manner establishing a communication link between the parent and child units wherein a plurality of random identification signals are generated, this communication link between said parent and child units being broken by activation of the switches in a second predetermined manner.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: April 14, 2015
    Inventors: Benson Chan, Jianzhuang Huang, Subahu Desai
  • Publication number: 20070249089
    Abstract: A method of making circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device.
    Type: Application
    Filed: June 12, 2007
    Publication date: October 25, 2007
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Subahu Desai, How Lin, John Lauffer, Voya Markovich, David Thomas
  • Publication number: 20070199195
    Abstract: A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure.
    Type: Application
    Filed: May 2, 2007
    Publication date: August 30, 2007
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Thomas Davis, Subahu Desai, John Lauffer, James McNamara, Voya Markovich
  • Publication number: 20070139977
    Abstract: A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.
    Type: Application
    Filed: December 19, 2005
    Publication date: June 21, 2007
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Subahu Desai, John Lauffer, How Lin, Voya Markovich, Ronald Smith
  • Publication number: 20060022303
    Abstract: A circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly capable of using the substrate is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.
    Type: Application
    Filed: July 28, 2004
    Publication date: February 2, 2006
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Subahu Desai, How Lin, John Lauffer, Voya Markovich, David Thomas