Patents by Inventor Subahu Dhirubhai Desai

Subahu Dhirubhai Desai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6093335
    Abstract: A method for planarizing an exposed metal surface on a substrate is provided in which surface irregularities are eliminated. A photoresist layer is first removed from the substrate. Then a conformal planarizing head is placed in contact with the metal surface while chemical etchant essentially free of abrasives is supplied to an interface between the metal substrate and the planarizing head. The surface is then planarized until it is free of irregularties.
    Type: Grant
    Filed: November 20, 1997
    Date of Patent: July 25, 2000
    Assignee: International Business Machines Corporation
    Inventors: Ashwinkumar C. Bhatt, John Christopher Camp, Subahu Dhirubhai Desai, Voya Rista Markovich, Michael Wozniak
  • Patent number: 6038137
    Abstract: A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.
    Type: Grant
    Filed: June 6, 1997
    Date of Patent: March 14, 2000
    Assignee: International Business Machines Corporation
    Inventors: Ashwinkumar Chinuprasad Bhatt, Subahu Dhirubhai Desai, Thomas Patrick Duffy, Jeffrey Alan Knight
  • Patent number: 5798909
    Abstract: A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.
    Type: Grant
    Filed: February 15, 1995
    Date of Patent: August 25, 1998
    Assignee: International Business Machines Corporation
    Inventors: Ashwinkumar Chinuprasad Bhatt, Subahu Dhirubhai Desai, Thomas Patrick Duffy, Jeffrey Alan Knight
  • Patent number: 5724232
    Abstract: A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.
    Type: Grant
    Filed: May 21, 1996
    Date of Patent: March 3, 1998
    Assignee: International Business Machines Corporation
    Inventors: Ashwinkumar Chinuprasad Bhatt, Subahu Dhirubhai Desai, Thomas Patrick Duffy, Jeffrey Alan Knight