Abstract: A method includes simulating a process, with computer-based software, to produce virtual data about the process; identifying process parameters for a real-world version of the process; providing a real-world sensor to sense a parameter associated with the real-world version of the process; receiving sensor readings from the real-world sensor while the real-world version is being performed; and training a machine-learning software model to predict a behavior of the real-world sensor based on the virtual data about the process, the process parameters, and the sensor readings.

Abstract: A method includes simulating a process, with computer-based software, to produce virtual data about the process; identifying process parameters for a real-world version of the process; providing a real-world sensor to sense a parameter associated with the real-world version of the process; receiving sensor readings from the real-world sensor while the real-world version is being performed; and training a machine-learning software model to predict a behavior of the real-world sensor based on the virtual data about the process, the process parameters, and the sensor readings.

Abstract: The present invention relates to a method and corresponding system for modeling a musculo-skeletal system. An embodiment of the method of the invention begins by scaling and positioning a musculo-skeletal model to correspond with motion capture data of a subject. Next, kinematically consistent motion data is generated from the motion capture data and then an inverse dynamic analysis of the musculo-skeletal model is performed using the generated kinematically consistent motion data, such that at least one analysis result is generated. The musculo-skeletal model is then updated to correspond with the at least one analysis result of the inverse dynamic analysis. Finally, the muscle activation of the updated musculo-skeletal model is optimized by determining at least one muscle force using the updated musculo-skeletal model, and by further updating the updated musculo-skeletal model to correspond with the determined at least one muscle force.

Abstract: The present invention relates to a method and corresponding system for modeling a musculo-skeletal system. An embodiment of the method of the invention begins by scaling and positioning a musculo-skeletal model to correspond with motion capture data of a subject. Next, kinematically consistent motion data is generated from the motion capture data and then an inverse dynamic analysis of the musculo-skeletal model is performed using the generated kinematically consistent motion data, such that at least one analysis result is generated. The musculo-skeletal model is then updated to correspond with the at least one analysis result of the inverse dynamic analysis. Finally, the muscle activation of the updated musculo-skeletal model is optimized by determining at least one muscle force using the updated musculo-skeletal model, and by further updating the updated musculo-skeletal model to correspond with the determined at least one muscle force.

Abstract: Methods for Implementation of a Switching Function in a Microscale Device and for Fabrication of a Microscale Switch. According to one embodiment, a method is provided for implementing a switching function in a microscale device. The method can include providing a stationary electrode and a stationary contact formed on a substrate. Further, a movable microcomponent suspended above the substrate can be provided. A voltage can be applied between the between a movable electrode of the microcomponent and the stationary electrode to electrostatically couple the movable electrode with the stationary electrode, whereby the movable component is deflected toward the substrate and a movable contact moves into contact with the stationary contact to permit an electrical signal to pass through the movable and stationary contacts. A current can be applied through the first electrothermal component to produce heating for generating force for moving the microcomponent.

Abstract: MEMS Device having Electrothermal Actuation and Release and Method for Fabricating. According to one embodiment, a microscale switch is provided and can include a substrate and a stationary electrode and stationary contact formed on the substrate. The switch can further include a movable microcomponent suspended above the substrate. The microcomponent can include a structural layer including at least one end fixed with respect to the substrate. The microcomponent can further include a movable electrode spaced from the stationary electrode and a movable contact spaced from the stationary electrode. The microcomponent can include an electrothermal component attached to the structural layer and operable to produce heating for generating force for moving the structural layer.

Abstract: Methods for Implementation of a Switching Function in a Microscale Device and for Fabrication of a Microscale Switch. According to one embodiment, a method is provided for implementing a switching function in a microscale device. The method can include providing a stationary electrode and a stationary contact formed on a substrate. Further, a movable microcomponent suspended above the substrate can be provided. A voltage can be applied between the between a movable electrode of the microcomponent and the stationary electrode to electrostatically couple the movable electrode with the stationary electrode, whereby the movable component is deflected toward the substrate and a movable contact moves into contact with the stationary contact to permit an electrical signal to pass through the movable and stationary contacts. A current can be applied through the first electrothermal component to produce heating for generating force for moving the microcomponent.

Abstract: An electro-statically actuated switch having a reduced gap distance between electrodes for reducing actuation voltage is provided. The invention provides more reliable electro-statically actuated switches. The invention provides a micro-electro-mechanical system (MEMS) that includes a recessed, movable electrode. The invention provides electro-statically actuated switches that reduce the likelihood of stiction and beam deformation and that allows lower actuation voltage for electrostatically actuated structures such as switches and mirrors. A method for fabricating such a design is provided that allows lower actuation voltage.

Abstract: MEMS Device Having A Trilayered Beam And Related Methods. According to one embodiment, a movable, trilayered microcomponent suspended over a substrate is provided and includes a first electrically conductive layer patterned to define a movable electrode. The first metal layer is separated from the substrate by a gap. The microcomponent further includes a dielectric layer formed on the first metal layer and having an end fixed with respect to the substrate. Furthermore, the microcomponent includes a second electrically conductive layer formed on the dielectric layer and patterned to define an electrode interconnect for electrically communicating with the movable electrode.

Abstract: A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communication lines to be transferred away from the communication lines.

Abstract: A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communication lines to be transferred away from the communication lines.

Abstract: The present invention relates to micro-electro-mechanical systems (MEMS). The present invention relates to a design feature that allows lower actuation voltage for electrostatically actuated structures (i.e., switches or mirrors). The present invention further relates to a method for fabricating such a design that allows lower actuation voltage.

Abstract: MEMS Device having Electrothermal Actuation and Release and Method for Fabricating. According to one embodiment, a microscale switch is provided and can include a substrate and a stationary electrode and stationary contact formed on the substrate. The switch can further include a movable microcomponent suspended above the substrate. The microcomponent can include a structural layer including at least one end fixed with respect to the substrate. The microcomponent can further include a movable electrode spaced from the stationary electrode and a movable contact spaced from the stationary electrode. The microcomponent can include an electrothermal component attached to the structural layer and operable to produce heating for generating force for moving the structural layer.

Abstract: A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communication lines to be transferred away from the communication lines.

Abstract: MEMS Device Having A Trilayered Beam And Related Methods. According to one embodiment, a movable, trilayered microcomponent suspended over a substrate is provided and includes a first electrically conductive layer patterned to define a movable electrode. The first metal layer is separated from the substrate by a gap. The microcomponent further includes a dielectric layer formed on the first metal layer and having an end fixed with respect to the substrate. Furthermore, the microcomponent includes a second electrically conductive layer formed on the dielectric layer and patterned to define an electrode interconnect for electrically communicating with the movable electrode.