Patents by Inventor Subi Kengeri

Subi Kengeri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8962421
    Abstract: A method for fabricating a FinFET integrated circuit includes depositing a first polysilicon layer at a first end of a diffusion region and a second polysilicon layer at a second end of the diffusion region; diffusing an n-type material into the diffusion region to form a diffused resistor; and epitaxially growing a silicon material between the first and second polysilicon layers to form fins structures over the diffused resistor and spanning between the first and second polysilicon layers.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: February 24, 2015
    Assignee: GLOBALFOUNDRIES, Inc.
    Inventors: Gopal Srinivasan, Andy Wei, Dinesh Somasekhar, Ali Keshavarzi, Subi Kengeri
  • Publication number: 20140134822
    Abstract: A method for fabricating a FinFET integrated circuit includes depositing a first polysilicon layer at a first end of a diffusion region and a second polysilicon layer at a second end of the diffusion region; diffusing an n-type material into the diffusion region to form a diffused resistor; and epitaxially growing a silicon material between the first and second polysilicon layers to form fins structures over the diffused resistor and spanning between the first and second polysilicon layers.
    Type: Application
    Filed: November 15, 2012
    Publication date: May 15, 2014
    Applicant: GLOBALFOUNDRIES, INC.
    Inventors: Gopal Srinivasan, Andy Wei, Dinesh Somasekhar, Ali Keshavarzi, Subi Kengeri