Abstract: A method of manufacturing a plurality of semiconductor packages includes preparing a plurality of molding structures each including a package substrate, at least one semiconductor chip attached onto the package substrate, a molding layer covering the package substrate and surrounding the at least one semiconductor chip, a plurality of package connection terminals attached to a lower surface of the package substrate, a release layer conformally covering the lower surface of the package substrate and conformally covering surfaces of the plurality of package connection terminals, and an adhesive layer covering the release layer, attaching the plurality of molding structures onto a support structure, forming a preliminary electromagnetic shielding layer covering an upper surface and side surfaces of each of the plurality of molding structures, and forming the plurality of semiconductor packages by photodecomposing the release layer and separating the adhesive layer from each of the plurality of molding structures

Abstract: A method of manufacturing a semiconductor package includes preparing a molding structure on which connection bumps are provided, forming a release layer at least partially filling spaces between the connection bumps, where the release layer includes a silicon (Si)-based polymer, forming an adhesive layer covering the release layer and the connection bumps, separating unit packages on which the release layer and the adhesive layer are formed by cutting the molding structure, the release layer, and the adhesive layer, attaching the unit packages to a base film by the adhesive layer, where the adhesive layer faces the base film, forming a shielding material layer covering at least a portion of each of the unit packages, at least a portion of the release layer, and at least a portion the adhesive layer, and separating the unit packages covered with the shielding material layer from the release layer.

Abstract: The present disclosure relates to system resource management in a variety of situations. The present disclosure provides a method and an apparatus for reducing memory requirements and improving processing speed when an electronic device performs padding for a particular arithmetic operation on data. To achieve the above objective, a method for operating an electronic device according to the present disclosure comprises the steps of: reading a first portion of data from a first memory; determining a first padding address based on the address of a byte belonging to a boundary region of the data among a plurality of bytes included in the first portion; writing values of the plurality of bytes and a value corresponding to the first padding address to a second memory; and reading a second portion of the data from the first memory.

Abstract: The present disclosure relates to system resource management in a variety of situations. The present disclosure provides a method and an apparatus for reducing memory requirements and improving processing speed when an electronic device performs padding for a particular arithmetic operation on data. To achieve the above objective, a method for operating an electronic device according to the present disclosure comprises the steps of: reading a first portion of data from a first memory; determining a first padding address based on the address of a byte belonging to a boundary region of the data among a plurality of bytes included in the first portion; writing values of the plurality of bytes and a value corresponding to the first padding address to a second memory; and reading a second portion of the data from the first memory.