Patents by Inventor Subin YUN

Subin YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240077248
    Abstract: A refrigerator is provided. The refrigerator includes: an outer case forming an exterior of the refrigerator; an inner case disposed inside the outer case, forming a storage compartment therein, and having a communication hole formed through a side surface thereof; a partition supported by the inner case to partition the storage compartment, and including a heat insulator inlet at a position corresponding to the communication hole; and a heat insulator filled between the outer case and the inner case and filled into the partition through the heat insulator inlet, wherein the partition includes a first vertical partitioning wall disposed between the outer case and the inner case and having a height to limit a size of the heat insulator inlet.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 7, 2024
    Inventors: Subin YUN, Inyong HWANG, Chulhee KIM, Seongchan LEE
  • Publication number: 20230204275
    Abstract: A refrigerator includes a body including an inner case, a first storage compartment, a second storage compartment, a third storage compartment, a first partition between the second storage and the third storage compartments, a second partition between the first and the second storage compartments, a cold air supplier in the third storage compartment to generate cold air, a first communication hole, a second communication hole to face the first communication hole, a first guide duct formed in the first partition to guide the cold air from the first communication hole to the second communication hole, and a second guide duct formed in the second partition to guide the cold air which has flown to the first guide duct, to the second storage compartment, the second guide duct connected to the first guide duct through the second communication hole.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 29, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seongchan LEE, Inyong HWANG, Ilsung BAE, Jinyoung SONG, Subin YUN, Wonho JANG, Youngmin YOU