Patents by Inventor Subodh Mhaisalkar

Subodh Mhaisalkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and structure for heatspreader attachment in high thermal performance IC packages
    Patent number: 6351032
    Abstract: Improved structures for and methods for assembling heatspreader attachments in integrated circuit packages permit attachment of a relatively low cost heatspreader having a high coefficient of thermal expansion directly to the back of a die while maximizing thermal performance, mechanical integrity and reliability of the assembly. The improvements are realized through the use of specific adhesive materials to attach the heatspreader to the die, heatspreader geometries, adhesive geometries, assembly techniques and underfill geometries.
    Type: Grant
    Filed: January 20, 2000
    Date of Patent: February 26, 2002
    Assignee: National Semiconductor Corporation
    Inventors: Bernard K H Lee, Ben T C Tan, Emillo F. Mallare, Jr., Sarvotham M. Bhandarkar, Subodh Mhaisalkar, Ai Min Tan