Patents by Inventor Subramanian Balakrishnan

Subramanian Balakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8000922
    Abstract: Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: August 16, 2011
    Assignee: KLA-Tencor Corp.
    Inventors: Hong Chen, Michael J. Van Riet, Chien-Huei (Adam) Chen, Jason Z. Lin, Chris Maher, Michal Kowalski, Barry Becker, Stephanie Chen, Subramanian Balakrishnan, Suryanarayana Tummala
  • Publication number: 20090299681
    Abstract: Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan.
    Type: Application
    Filed: May 29, 2008
    Publication date: December 3, 2009
    Inventors: Hong Chen, Michael J. Van Riet, Chien-Huei (Adam) Chen, Jason Z. Lin, Chris Maher, Michal Kowalski, Barry Becker, Stephanie Chen, Subramanian Balakrishnan, Suryanarayana Tummala