Abstract: A method of manufacturing an organic lighting device, having a form factor substantially equal to or less than 900 square centimeters, without involving a cutting process is provided. The method includes providing one or more first substrates with a size substantially equal to the form factor. Thereafter, the method includes a high throughput first processing of the one or more first substrates and active layer deposition processing on the one or more first substrates. Further, one or more second substrates having a size substantially equal or less than the form factor are provided. Thereafter, a high throughput second processing is performed on the one or more second substrates. Finally, the method includes encapsulating at least one of the one or more first substrates with at least one of the one or more second substrates to form the organic lighting device having the form factor.

Abstract: A method of manufacturing an organic lighting device, having a form factor substantially equal to or less than 900 square centimeters, without involving a cutting process is provided. The method includes providing one or more first substrates with a size substantially equal to the form factor. Thereafter, the method includes a high throughput first processing of the one or more first substrates and active layer deposition processing on the one or more first substrates. Further, one or more second substrates having a size substantially equal or less than the form factor are provided. Thereafter, a high throughput second processing is performed on the one or more second substrates. Finally, the method includes encapsulating at least one of the one or more first substrates with at least one of the one or more second substrates to form the organic lighting device having the form factor.

Abstract: An article involving encapsulation of one or more hygroscopic materials and manufacturing method and system thereof are provided. The article includes a first substrate, a second substrate, one or more first structures formed at a first periphery associated with the first substrate, and one or more second structures formed at a second periphery associated with the second substrate. The first structures and the second structures are engaged together mechanically to form an enclosure between the first substrate and the second substrate. The enclosure is capable of preventing exposure of a hygroscopic material encapsulated between the first substrate and the second substrate to the surrounding environment.

Abstract: An intermediate processing layer provides for the inclusion of procurement functionalities of a multi-level enterprise business application by bridging processing and other operational gaps in the enterprise application. The invention further includes the methodology for operating the procurement management system including numerous processing steps or operations, which may be guided in part based on software-based executable instructions or guidelines incorporated into or governing the executable operations. The procurement system includes four defined portals, a procurement portal, a sourcing portal, a reporting portal, and a supplier portal. The procurement system further includes additional levels of support, information or other layers of user interface. These portals and layers are disposed within existing processing components of the business enterprise suite and provide an interactive component to various users, specifically through the portals.

Abstract: A radiation image-able data storage medium according to one exemplary embodiment is provided in the present disclosure that includes a substrate having at least one diffractive feature formed on a surface of the substrate. The radiation image-able data storage medium may also include a radiation-sensitive layer that may be coupled to the substrate.