Patents by Inventor Sudarashan V. Rangaraj

Sudarashan V. Rangaraj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatuses and methods to enhance passivation and ILD reliability
    Patent number: 10002814
    Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: June 19, 2018
    Assignee: Intel Corporation
    Inventors: Richard J. Harries, Sudarashan V. Rangaraj, Robert L. Sankman
  • APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY
    Publication number: 20140175643
    Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.
    Type: Application
    Filed: March 3, 2014
    Publication date: June 26, 2014
    Inventors: Richard J. Harries, Sudarashan V. Rangaraj, Robert L. Sankman
  • Apparatuses and methods to enhance passivation and ILD reliability
    Patent number: 8664771
    Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: March 4, 2014
    Assignee: Intel Corporation
    Inventors: Richard J. Harries, Sudarashan V. Rangaraj, Bob Sankman
  • APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY
    Publication number: 20120241952
    Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.
    Type: Application
    Filed: June 11, 2012
    Publication date: September 27, 2012
    Inventors: Richard J. Harries, Sudarashan V. Rangaraj, Bob Sankman
  • Apparatuses and methods to enhance passivation and ILD reliability
    Patent number: 8198185
    Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: June 12, 2012
    Assignee: Intel Corporation
    Inventors: Richard J. Harries, Sudarashan V. Rangaraj, Bob Sankman
  • APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY
    Publication number: 20090325347
    Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.
    Type: Application
    Filed: September 4, 2009
    Publication date: December 31, 2009
    Inventors: Richard J. Harries, Sudarashan V. Rangaraj, Bob Sankman