Abstract: A device include a first camera, a second camera, and a shutter assembly. The shutter assembly includes a switch, a link coupled to the switch and having a first cover, and an arm coupled to the link and having a second cover. Actuating the switch to a first position disposes the first cover within a first field of view of the first camera and the second cover within a second field of view of the second camera. Actuating the switch to a second position disposes the first cover outside of the first field of view and the second cover outside of the second field of view.

Abstract: A device includes a housing having a top, a bottom opposite the top, a front, and a back opposite the front. One or more microphones are oriented substantially towards the top. A first camera, a display, a loudspeaker, and an emitter are oriented substantially towards the front. A second camera, a projector, and a sensor are oriented substantially towards the bottom. The second camera and the sensor may include field of views that at least partially overlap with a projection area of the projector.

Abstract: A device include a first camera, a second camera, and a shutter assembly. The shutter assembly includes a switch, a link coupled to the switch and having a first cover, and an arm coupled to the link and having a second cover. Actuating the switch to a first position disposes the first cover within a first field of view of the first camera and the second cover within a second field of view of the second camera. Actuating the switch to a second position disposes the first cover outside of the first field of view and the second cover outside of the second field of view.

Abstract: A device includes a housing having a top, a bottom opposite the top, a front, and a back opposite the front. One or more microphones are oriented substantially towards the top. A first camera, a display, a loudspeaker, and an emitter are oriented substantially towards the front. A second camera, a projector, and a sensor are oriented substantially towards the bottom. The second camera and the sensor may include field of views that at least partially overlap with a projection area of the projector.

Abstract: A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.

Abstract: Methods of forming a microelectronic device and associated structures are described. Those methods may comprise forming a die-side conductive interconnect on a substrate, wherein the die-side conductive interconnect comprises a columnar portion and a base portion, and wherein a diameter of the base portion is greater than a diameter of the columnar portion.

Abstract: Methods of forming a microelectronic device and associated structures are described. Those methods may comprise forming a die-side conductive interconnect on a substrate, wherein the die-side conductive interconnect comprises a columnar portion and a base portion, and wherein a diameter of the base portion is greater than a diameter of the columnar portion.

Abstract: Methods of forming a microelectronic device and associated structures are described. Those methods may comprise forming a die-side conductive interconnect on a substrate, wherein the die-side conductive interconnect comprises a columnar portion and a base portion, and wherein a diameter of the base portion is greater than a diameter of the columnar portion.

Abstract: A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.

Abstract: Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die disposed on the substrate, and plurality of solder paste disposed between the die and the substrate; reflowing the solder paste by exposing the die-substrate combination to temperatures changes including heating the die-substrate combination to liquefy the solder paste, and cooling down the die-substrate combination until the solder paste has solidified to form solder joints to yield the package; and controlling an expansion of the die and the substrate at least during cooling down to mitigate a relative difference in volumetric strain between the die and the substrate. Controlling may comprise exposing the die-substrate combination to pressure changes at least during cooling down.

Abstract: Embodiments of a method for attaching a die to a substrate using a flame or other heat source are disclosed. The flame may be produced by combustible gas. Also disclosed are embodiments of a system for performing die attach using a flame. Other embodiments are described and claimed.