Abstract: A virtual Radio Access Network (vRAN) system (300) for provisioning a virtual Radio Access Network (RAN) that is portable across one or more RAN hardware platforms is provided. The virtual Radio Access Network (vRAN) system (300) includes a waveform development kit (WDK) (302), and a waveform execution environment (304). The waveform development kit (302) defines at least one portable Radio Access Network (RAN) application into a form that is instantiated on a RAN hardware (326). The waveform execution environment (304) (i) monitors real-time schedulable resources in real-time, and (ii) collects one or more statistics and monitors the one or more statistics for network automation. The waveform execution environment (304) includes a RAN hypervisor (314) that virtualizes at least one attribute of a spectral resource required to provision the RAN that is portable across at least one hardware platform of the one or more RAN hardware platforms in the RAN hardware.

Abstract: A virtual Radio Access Network (vRAN) system (300) for provisioning a virtual Radio Access Network (RAN) that is portable across one or more RAN hardware platforms is provided. The virtual Radio Access Network (vRAN) system (300) includes a waveform development kit (WDK) (302), and a waveform execution environment (304). The waveform development kit (302) defines at least one portable Radio Access Network (RAN) application into a form that is instantiated on a RAN hardware (326). The waveform execution environment (304) (i) monitors real-time schedulable resources in real-time, and (ii) collects one or more statistics and monitors the one or more statistics for network automation. The waveform execution environment (304) includes a RAN hypervisor (314) that virtualizes at least one attribute of a spectral resource required to provision the RAN that is portable across at least one hardware platform of the one or more RAN hardware platforms in the RAN hardware.

Abstract: A system and method for maintaining a database with a plurality of replicas that are geographically distributed. A plurality of tables are stored in a first replica, each table including a plurality of records. The system identifying if the record is a stub and requesting a lease from a second replica designated as master for the record if the record is a stub. The system receiving a copy of the record from the second replica and storing data fields of the record in the first replica after receiving the lease.

Abstract: A method and system for maintaining a database with a plurality of replicas that are geographically distributed. A plurality of tables are stored in the database, each table includes a plurality of records. The location where each record is stored being controlled based on a constraint property included in the record.

Abstract: A linear coefficient of thermal expansion (CTE) mismatch between two materials, such as between a microelectronic die and a mounting substrate, may induce stress at the interface of the materials. The temperature changes present during the process of attaching a die to a mounting substrate can cause cracking and failure in the electrical connections used to connect the die and mounting substrate. A material with a CTE approximately matching the die CTE is introduced in the mounting substrate to reduce the stress and cracking at the electrical connections between the die and mounting substrate. Additionally, this material may comprise thin film capacitors useful for decoupling power supplies.

Abstract: Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die disposed on the substrate, and plurality of solder paste disposed between the die and the substrate; reflowing the solder paste by exposing the die-substrate combination to temperatures changes including heating the die-substrate combination to liquefy the solder paste, and cooling down the die-substrate combination until the solder paste has solidified to form solder joints to yield the package; and controlling an expansion of the die and the substrate at least during cooling down to mitigate a relative difference in volumetric strain between the die and the substrate. Controlling may comprise exposing the die-substrate combination to pressure changes at least during cooling down.

Abstract: Disclosed is a packaged integrated circuit and a method of forming thereof. The packaged integrated circuit includes a substrate, a plurality of solder bumps, a semiconductor die and a plurality of copper bumps. The plurality of solder bumps are configured on the substrate. Each of the plurality of solder bumps has a height of about 40 micrometers (?m) to about 65 ?m. Further, the plurality of copper bumps are configured on the semiconductor die. Each of the plurality of copper bumps has a height of about 10 ?m to about 25 ?m. The semiconductor die is disposed above the substrate such that the plurality of copper bumps are coupled to the plurality of solder bumps, which in turn, couples the semiconductor die to the substrate.

Abstract: A linear coefficient of thermal expansion (CTE) mismatch between two materials, such as between a microelectronic die and a mounting substrate, may induce stress at the interface of the materials. The temperature changes present during the process of attaching a die to a mounting substrate can cause cracking and failure in the electrical connections used to connect the die and mounting substrate. A material with a CTE approximately matching the die CTE is introduced in the mounting substrate to reduce the stress and cracking at the electrical connections between the die and mounting substrate. Additionally, this material may comprise thin film capacitors useful for decoupling power supplies.

Abstract: A microelectronic assembly is provided, comprising at least a first microelectronic die carrying a microelectronic circuit, at least a first periphery seal attached to an edge of a surface of the microelectronic die, at least a first solder thermal interface material attached to a central region of the surface of the microelectronic die, the solder thermal interface material having a higher thermal conductivity than the periphery seal, and a thermally conductive member attached to the periphery seal and the solder thermal interface material on a side thereof opposing the microelectronic die.

Abstract: Embodiments of a method for attaching a die to a substrate using a flame or other heat source are disclosed. The flame may be produced by combustible gas. Also disclosed are embodiments of a system for performing die attach using a flame. Other embodiments are described and claimed.