Patents by Inventor Sudha Gopalan Zingg

Sudha Gopalan Zingg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Testing for correct undercutting of an electrode during an etching step
    Patent number: 8063401
    Abstract: A probe electrode structure on a substrate is described, comprising a first probe electrode and a neighboring second probe electrode on a layer sequence that generally includes, in a direction from the substrate to the probe electrodes, an electrically conductive bottom layer, an electrically insulating center layer and a electrically conductive top layer. The probe-electrode structure of the invention provides a means to detect an undercutting of the first probe electrode in an etching step that aims at removing the top layer from regions outside the first probe electrode. An undercutting that exceeds an admissible distance from the first edge of the first electrode will remove the first top-layer probe section in the first probe opening, which causes a detectable change of the electrical resistance between the first and second probe electrodes.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: November 22, 2011
    Assignee: NXP B.V.
    Inventors: Rene P. Zingg, Sudha Gopalan Zingg, Herman E. Doornveld, Theodorus H. G. Martens
  • TESTING FOR CORRECT UNDERCUTTING OF AN ELECTRODE DURING AN ETCHING STEP
    Publication number: 20100190278
    Abstract: A probe electrode structure on a substrate is described, comprising a first probe electrode and a neighboring second probe electrode on a layer sequence that generally includes, in a direction from the substrate to the probe electrodes, an electrically conductive bottom layer, an electrically insulating center layer and a electrically conductive top layer. The probe-electrode structure of the invention provides a means to detect an undercutting of the first probe electrode in an etching step that aims at removing the top layer from regions outside the first probe electrode. An undercutting that exceeds an admissible distance from the first edge of the first electrode will remove the first top-layer probe section in the first probe opening, which causes a detectable change of the electrical resistance between the first and second probe electrodes.
    Type: Application
    Filed: August 14, 2007
    Publication date: July 29, 2010
    Applicant: NXP, B.V.
    Inventors: Rene P. Zingg, Sudha Gopalan Zingg, Herman E. Doornveld, Theodorus H.G. Martens