Patents by Inventor Sudheera Sudhakar

Sudheera Sudhakar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12230866
    Abstract: Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: February 18, 2025
    Assignee: Intel Corporation
    Inventors: Jayprakash Thakur, Maruti Tamrakar, Sagar Gupta, Prasanna Pichumani, Sudheera Sudhakar
  • Patent number: 12117876
    Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.
    Type: Grant
    Filed: November 21, 2020
    Date of Patent: October 15, 2024
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Samarth Alva, Bhavaneeswaran Anbalagan, Triplicane Gopikrishnan Babu, Prasanna Pichumani, Raghavendra Doddi, Sudheera Sudhakar, Ritu Bawa
  • Publication number: 20240210988
    Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.
    Type: Application
    Filed: March 31, 2023
    Publication date: June 27, 2024
    Inventors: David Pidwerbecki, Arvind S, Jeff Ku, Juha Tapani Paavola, Prakash Kurma Raju, Amruta Krishnakumar Ranade, Sudheera Sudhakar, Mousumi Deka, Snehal Chaudhari, Akarsha R. Kadadevaramath
  • Publication number: 20210111481
    Abstract: Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Inventors: Jayprakash Thakur, Maruti Tamrakar, Sagar Gupta, Prasanna Pichumani, Sudheera Sudhakar
  • Publication number: 20210103317
    Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.
    Type: Application
    Filed: November 21, 2020
    Publication date: April 8, 2021
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Samarth Alva, Bhavaneeswaran Anbalagan, Triplicane Gopikrishnan Babu, Prasanna Pichumani, Raghavendra Doddi, Sudheera Sudhakar, Ritu Bawa